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The onsemi EFC6612R-A-TF is a dual N-channel MOSFET array housed in a compact 6-CSP (1.77x3.54 mm) surface-mount package. It features a drain-source breakdown voltage of 20 V and supports a continuous drain current of 23 A. The device exhibits a maximum on-resistance of 4.2 mΩ at specified conditions, ensuring low conduction losses in power management circuits. With a power dissipation rating of 2.5 W, this component is engineered for high-efficiency switching applications requiring robust performance within small form factors.
Verify the specific suffix 'A' against official onsemi documentation to confirm exact electrical tolerances and marking codes. Ensure the 6-CSP package dimensions match the target PCB footprint. Confirm that the 20 V rating aligns with system voltage requirements. Cross-reference the 23 A current rating with thermal constraints in the final assembly. Validate that the 4.2 mΩ resistance meets efficiency targets under operating load conditions.
Select this component when space-constrained designs require dual N-channel MOSFETs with high current capacity. The 20 V rating suits low-voltage DC-DC conversion systems. Consider the 2.5 W power dissipation limit for thermal management strategies. The compact CSP package facilitates automated assembly in dense layouts. Ensure gate drive voltages are compatible with the threshold characteristics documented in the datasheet.
This part belongs to onsemi's EFCP series of power MOSFET arrays. It complements other components in the EFC66xx family, offering similar functionality with specific voltage and current ratings tailored for modern portable electronics and industrial power supplies. The series emphasizes miniaturization without compromising electrical performance.
Public confirmed substitute part numbers: EFC6612R-TF.