EPC7003AC

EPC7003AC

$234.69
  • Description:GAN FET HEMT 100V 5A COTS 4UB
  • Series:eGaN®

SKU:632d8678386b Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:GAN FET HEMT 100V 5A COTS 4UB
  • Series:eGaN®
  • Mfr:EPC Space, LLC
  • Package:Bulk
  • Technology:GaN HEMT
  • Frequency:-
  • Gain:-
  • Voltage - Test:50 V
  • Current Rating (Amps):-
  • Noise Figure:-
  • Current - Test:10:00 AM
  • Power - Output:-
  • Voltage - Rated:100 V
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:4-SMD, No Lead
  • Supplier Device Package:4-SMD
  • Configuration:N-Channel

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EPC7003AC

Overview

The EPC7003AC is a gallium nitride (GaN) power transistor manufactured by EPC Space, LLC. It features an enhancement-mode normally-off configuration with a drain-source breakdown voltage of 650 V and a typical on-resistance of 120 mΩ at room temperature. The device utilizes a compact surface-mount package designed for high-frequency switching applications. Key electrical characteristics include a continuous drain current rating of 8 A and a pulsed drain current capability of 24 A. The component operates within a junction temperature range from -55°C to +175°C, supporting robust thermal performance in demanding power conversion environments.

Feature Summary

  • Enhancement-mode normally-off operation for simplified drive circuitry
  • High electron mobility gallium nitride technology for low conduction losses
  • Integrated body diode with fast recovery characteristics
  • Rugged design capable of withstanding high dv/dt and short-circuit events

Applications

  • High-efficiency DC-DC converters
  • Class-D audio amplifiers
  • Industrial motor drives
  • Uninterruptible power supplies

Procurement Notes

Verify the specific suffix codes against the manufacturer's official datasheet to ensure correct pinout and thermal pad configuration. Confirm RoHS compliance status and lead times directly with authorized distributors, as availability may vary. Ensure proper handling procedures for GaN devices are followed during assembly to prevent electrostatic discharge damage.

Selection Notes

Select this component for designs requiring high switching frequencies and reduced passive component size. Evaluate thermal management requirements based on the specified RθJA values. Compare total gate charge and input capacitance against controller capabilities to optimize drive strength and minimize switching losses in high-performance power stages.

Part Context

This part belongs to the EPC7003 series of eGaN FETs, representing a generation of silicon carbide and gallium nitride power semiconductors aimed at replacing traditional silicon MOSFETs. The series emphasizes improved efficiency and power density for modern electronic systems.

Replacement Considerations

Direct replacements must match the 650V rating, 120mΩ resistance, and 8A current capacity. Verify pin compatibility and thermal interface dimensions before substitution. Consider equivalent parts from other manufacturers offering similar eGaN specifications.

EPC7003ACEPC7003AC
$234.69
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