F3L150R12W2H3BOMA1

Overview

The Infineon F3L150R12W2H3_B11 is a high-speed IGBT module in the EasyPACK package, featuring active Neutral Point Clamp 2 topology and PressFIT contact technology. It integrates two high-voltage IGBTs (T1/T4) rated at 1200V with a continuous collector current of 75A and repetitive peak current of 300A. Two low-voltage IGBTs (T2/T3) are rated at 650V with 75A continuous current. The module includes complementary diodes: D2/D3 rated at 650V/125A and D1/D4 rated at 1200V/50A. Key electrical parameters include VCES up to 1200V, VGE ±20V, and operating junction temperatures from -40°C to 150°C. Thermal resistance RthJC ranges from 0.25 to 0.70 K/W depending on the specific switch.

Feature Summary

• Active Neutral Point Clamp 2 topology for three-level applications
• PressFIT connection technology for robust mechanical mounting
• Integrated NTC thermistor for temperature monitoring
• RoHS compliant construction

Applications

• Three-level inverter topologies
• Solar power inverters

Procurement Notes

Verify the exact ordering suffix against the manufacturer's official documentation to ensure correct configuration. Confirm that the component matches the specified EasyPACK form factor and utilizes PressFIT termination rather than solder pins. Cross-reference the internal material number found on the module label with the purchase order to prevent substitution errors during assembly.

Selection Notes

Select this module for designs requiring asymmetric voltage ratings within a single package, combining 1200V and 650V switches. Ensure the gate drive circuitry supports the specified VGE limits and internal gate resistances. Verify that the PCB layout accommodates the PressFIT pin dimensions and that the thermal management system can handle the specified RthJC values under the expected switching frequency and load conditions.

Part Context

This component belongs to Infineon's EasyPACK series, designed for compact power conversion systems. The 'F3' designation indicates a three-level module configuration. The H3 suffix denotes the use of high-speed IGBT technology, which optimizes the trade-off between conduction losses and switching speed compared to standard or field-stop technologies.

Replacement Considerations

Direct replacements must match the EasyPACK footprint, Pinout, and electrical ratings. Verify if alternative modules support the same Active NPC2 topology. Check compatibility of the PressFIT interface with existing PCB pads. Note that newer revisions may have updated thermal characteristics or gate charge values.