F3L15R12W2H3B27BOMA1

Overview

The F3L15R12W2H3B27BOMA1 is a power module from Infineon's PrimePACK 3 family, designed for high-power industrial applications. It integrates three IGBTs with anti-parallel diodes in a single package. The device features a 1200V blocking voltage and a nominal collector current of 15A per leg. Key electrical parameters include a maximum DC collector current of 45A and a continuous RMS current of 27A. The module utilizes wire bond technology and offers low switching losses. Thermal performance is optimized with a specific thermal resistance values for junction-to-case and case-to-sink interfaces.

Feature Summary

• Integrates three insulated gate bipolar transistors with anti-parallel diodes for compact three-phase or bridge configurations.
• Utilizes advanced wire bond interconnect technology to ensure robust mechanical stability and reliable electrical connections under high thermal cycling.
• Engineered for low conduction and switching losses to enhance overall system efficiency in high-frequency operation.

Applications

• Industrial motor drives and servo systems requiring high reliability.
• Uninterruptible power supplies (UPS) and static transfer switches.
• High-efficiency solar inverters and wind turbine converters.

Procurement Notes

Verify the exact suffix BOMA1 against the manufacturer's latest datasheet to confirm pinout compatibility and thermal interface specifications. Ensure that the ordering code matches the required packaging variant and terminal configuration for your specific PCB layout. Cross-reference the date code and lot number to meet quality assurance standards for critical infrastructure projects.

Selection Notes

Select this component when designing systems requiring a balance between high voltage blocking capability and moderate current handling within a compact form factor. Evaluate the thermal management requirements based on the specified thermal resistance values to ensure the junction temperature remains within safe operating limits during peak load conditions.

Part Context

This part belongs to Infineon's PrimePACK 3 series, which is widely used in medium-power industrial applications. The series is known for its standardized dimensions and enhanced thermal performance compared to previous generations. It serves as a direct replacement for older modules in existing designs where space constraints and efficiency improvements are prioritized.

Replacement Considerations

Check for equivalent parts in the same PrimePACK 3 family with similar current ratings. Verify that any substitute maintains the same pinout and mounting hole pattern to avoid redesigning the mechanical assembly. Confirm that the switching characteristics of the alternative device fit within the control loop bandwidth of the existing driver circuitry.