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The F3L200R07W2S5FPB55BPSA1 is a 650 V, 200 A three-level IGBT module from Infineon Technologies. It utilizes the EasyPACK 2B package and Trenchstop 5 technology. The device features a continuous collector current of 200 A at 25 °C and a maximum collector-emitter voltage of 650 V. Operating temperatures range from -40 °C to +150 °C. The module employs press-fit installation for secure thermal and electrical connection.
Verify the specific suffix BPSA1 against official Infineon documentation to confirm exact manufacturing lot and testing criteria. Ensure compatibility with press-fit assembly tools and verify thermal interface material requirements for the EasyPACK 2B housing before integration into final designs.
Select this component for applications requiring high current density and low switching losses in three-level topologies. Consider the 650 V rating and 200 A capacity relative to system voltage and load requirements. Evaluate thermal management solutions suitable for press-fit modules and EasyPACK 2B dimensions.
This part belongs to the Infineon EasyPACK 2B series, designed for high-power density applications. It integrates Trenchstop 5 IGBTs with anti-parallel diodes. The series targets industrial and traction markets where efficiency and compact size are critical constraints for power conversion systems.
Consult official Infineon substitution guides for verified equivalents. Cross-reference pinout and thermal characteristics when considering alternative three-level modules from other manufacturers.