F3L200R12W2H3BOMA1

F3L200R12W2H3BOMA1

$52.82
  • Description:F3L200R12W2H3B - IGBT
  • Series:-

SKU:2640f84326e7 Category: Brand:

  
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Product Detailed Parameters

  • Description:F3L200R12W2H3B - IGBT
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:-
  • Configuration:-
  • Vce(on) (Max) @ Vge, Ic:-
  • Input:-
  • NTC Thermistor:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Voltage - Collector Emitter Breakdown (Max):-
  • Current - Collector (Ic) (Max):-
  • Power - Max:-
  • Current - Collector Cutoff (Max):-
  • Input Capacitance (Cies) @ Vce:-

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F3L200R12W2H3BOMA1

Overview

The F3L200R12W2H3BOMA1 is a High Speed IGBT H3 module utilizing active Neutral Point Clamp 2 topology. It features PressFIT and NTC integration within an EasyPACK housing. The main IGBTs (T1/T4) support a collector-emitter voltage of 1200 V, with a continuous DC current of 100 A at 100°C case temperature and a repetitive peak current of 200 A. The clamping IGBTs (T2/T3) are rated for 650 V with a continuous DC current of 100 A. The module operates up to a junction temperature of 150°C.

Feature Summary

  • Active Neutral Point Clamp 2 topology
  • PressFIT contact technology
  • Integrated NTC thermistor

Applications

  • 3-level applications
  • Motor drives
  • Solar applications
  • UPS systems

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm mechanical and electrical compatibility. Confirm that the component matches the required insulation class and thermal resistance specifications for the target application environment before finalizing procurement.

Selection Notes

Select this module for designs requiring high-speed switching capabilities in three-level topologies. Ensure the gate driver circuitry supports the specified internal gate resistance values. Verify that the system's thermal management can handle the junction-to-case thermal resistance under maximum load conditions.

Part Context

This component belongs to the Infineon EasyPACK series, designed for industrial power conversion. It utilizes trench field-stop technology to optimize switching losses and on-state voltage. The module integrates multiple semiconductor chips into a single insulated package for efficient power handling.

Replacement Considerations

Consult official Infineon cross-reference lists for verified substitutes. Ensure any replacement maintains identical pinout, thermal characteristics, and voltage ratings.

F3L200R12W2H3BOMA1F3L200R12W2H3BOMA1
$52.82
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