F3L400R10W3S7B11BPSA1

$127.52

Description：IGBT MODULE LOW POWER EASY
Series：-

SKU:cc9b8c02e8f1 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE LOW POWER EASY
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：Trench
Configuration：-
Vce(on) (Max) @ Vge, Ic：1.4V @ 15V, 150A
Input：-
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：Module
Voltage - Collector Emitter Breakdown (Max)：950 V
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：70 µA
Input Capacitance (Cies) @ Vce：25.2 nF @ 25 V

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F3L400R10W3S7B11BPSA1

Overview

The Infineon F3L400R10W3S7B11BPSA1 is a 950 V, 400 A three-level IGBT module utilizing TRENCHSTOP™ IGBT7 technology and Emitter Controlled 7 diodes. It features PressFIT contact technology for board mounting and includes an integrated NTC temperature sensor. The module supports a maximum junction temperature of 175°C and operates within a range of -40°C to 150°C. Key electrical parameters include a collector-emitter saturation voltage (VCEsat) of 1.48 V at 25°C for the main legs, with a repetitive peak collector current (ICRM) of 800 A. The module weighs 78 g and provides high current density with low switching losses.

Feature Summary

TRENCHSTOP™ IGBT7 technology for reduced switching losses
PressFIT connection technology for flexible PCB integration
Integrated NTC temperature sensor for thermal monitoring
Emitter Controlled 7 diode design

Applications

Three-level applications
Solar applications

Procurement Notes

Verify component authenticity by cross-referencing the module label code against official Infineon documentation. Ensure the ordering suffix matches the specific variant required. Confirm RoHS compliance status through the manufacturer's official product qualification reports before finalizing procurement orders.

Selection Notes

Select this module for designs requiring high current density and low switching losses in three-level topologies. Verify that the gate drive circuitry accommodates the specified internal gate resistance and charge requirements. Ensure the mechanical layout supports the PressFIT mounting process and that the thermal management system maintains the junction temperature within the 175°C limit.

Part Context

This component belongs to the EasyPACK™ series of modules from Infineon Technologies. It is part of the broader TRENCHSTOP™ IGBT7 family, which utilizes micro-trench gate technology to enhance device controllability and reduce power dissipation in industrial drive and renewable energy applications.

Replacement Considerations

Consult official Infineon substitution guides for verified alternatives. Do not assume pin-to-pin compatibility with other EasyPACK models without verifying electrical parameters and mechanical dimensions.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.