FB20R06W1E3B11BPSA1

Overview

The FB20R06W1E3B11BPSA1 is a Power Integrated Module (PIM) utilizing Trench/Fieldstop IGBT3 technology. It integrates three-phase inverter IGBTs and diodes, a brake-chopper IGBT and diode, and a rectifier bridge with an NTC thermistor. Key electrical parameters include a collector-emitter voltage of 600 V, nominal continuous collector current of 20 A at 95°C case temperature, and repetitive peak collector current of 40 A. The module features low switching losses and a positive temperature coefficient for VCEsat. Thermal resistance from junction to case is 1.45 K/W per IGBT and 1.95 K/W per inverter diode.

Feature Summary

• Integrates three-phase inverter, brake-chopper, and rectifier circuits within a single compact package.
• Incorporates an NTC thermistor for precise internal temperature monitoring.
• Utilizes PressFIT contact technology for robust mechanical mounting and electrical connection.
• Features Al2O3 substrate design providing low thermal resistance and high insulation strength.

Applications

• Auxiliary inverters
• Air conditioning systems
• Motor drives

Procurement Notes

Verify the specific ordering suffix BPSA1 against official Infineon documentation to confirm exact packaging or tape-and-reel specifications. Ensure compatibility with PressFIT assembly tools and verify that the requested quantity matches the manufacturer's standard shipping configuration. Cross-reference the full part number with the latest datasheet revision to confirm component availability and lead times.

Selection Notes

Select this module for applications requiring integrated power conversion with built-in thermal sensing. The 600V rating suits medium-voltage AC drive and HVAC systems. Verify that the system's DC bus voltage remains below the 600V limit and that the required continuous current does not exceed the 20A nominal rating at the intended case temperature of 95°C.

Part Context

This component belongs to the EasyPIM family from Infineon Technologies. It combines Trench/Fieldstop IGBT3 chips with emitter-controlled diodes. The module architecture consolidates multiple power stages into one unit, reducing board space and parasitic inductance compared to discrete solutions.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult Infineon technical support for direct replacements or pin-compatible alternatives within the EasyPIM series.