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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The FCP165N65S3R0 is a single N-channel SuperFET III MOSFET manufactured by onsemi, not Fairchild Semiconductor. It utilizes silicon technology in a TO-220-3 through-hole package. Key electrical parameters include a drain-source breakdown voltage (Vds) of 650 V and a continuous drain current (Id) of 19 A. The device features a maximum on-resistance (Rds(on)) of 165 mΩ at 10 V gate drive. Gate-source voltage limits are ±30 V with a threshold voltage of 2.5 V. Total gate charge (Qg) is 39 nC. Power dissipation is rated at 154 W. Operating temperature ranges from -55 °C to +150 °C junction temperature.
Verify manufacturer identity as the component is produced by onsemi. Confirm obsolescence status prior to procurement as the lifecycle indicates end-of-life. Ensure design-in compatibility with existing thermal management solutions given the TO-220-3 package constraints. Validate that the 650V rating meets system voltage requirements.
Select this component for applications requiring low conduction losses at 650V ratings. Compare Rds(on) and Qg values against alternative SuperFET generations for efficiency optimization. Consider the TO-220-3 package for through-hole assembly requirements. Evaluate thermal resistance characteristics for heat sink sizing in high-power density designs.
This part belongs to the SuperFET III family, which combines trench MOSFET technology with an integrated fast recovery body diode. The series targets high-efficiency power conversion systems. The specific model denotes the 165 mΩ on-resistance variant within the 650V voltage class lineup.
FCPF165N65S3R0L: Similar specifications but in a TO-220F package with different thermal characteristics and gate charge.