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FDC6020C is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET N/P-CH 20V 5.9A 6SSOT. Review the specifications below when checking this part for your BOM.
The FDC6020C is a complementary PowerTrench MOSFET array integrating an N-channel and P-channel device in a SuperSOT-6 FLMP package. The N-channel transistor (Q2) supports a drain-source voltage of 20 V with a continuous current of 5.9 A and an on-resistance of 27 mΩ at VGS = 4.5 V. The P-channel transistor (Q1) provides a drain-source voltage of -20 V, a continuous current of -4.2 A, and an on-resistance of 55 mΩ at VGS = -4.5 V. Both devices operate within a junction temperature range of -55°C to +150°C.
Verify the component status as obsolete before procurement planning. Confirm that the datasheet reflects Fairchild Semiconductor specifications, noting potential corporate transitions. Ensure design-in compatibility with legacy system requirements if sourcing from secondary markets.
Select this component for low-voltage battery-powered systems requiring minimal inline power loss. Evaluate thermal resistance parameters against board copper pad designs to ensure safe operating area compliance under single or dual operation modes.
This device belongs to the PowerTrench series, utilizing advanced trench technology to minimize on-state resistance while maintaining superior switching characteristics. It represents a specialized solution for high-efficiency power management in space-constrained electronic designs.
Check for direct pin-compatible alternatives from current manufacturers. Verify that any substitute maintains identical electrical ratings and package dimensions to ensure seamless integration without circuit redesign.
The N-channel device (Q2) has a maximum continuous drain current of 5.9 A.
For Q2, RDS(on) is 27 mΩ at VGS = 4.5 V and increases to 39 mΩ at VGS = 2.5 V.
The thermal resistance junction-to-ambient is 68 °C/W when mounted on a 1in² pad of 2 oz copper for single operation.
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