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FDC655N is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is MOSFET N-CH. Review the specifications below when checking this part for your BOM.
The FDC655N is a single N-channel logic level PowerTrench MOSFET manufactured by Fairchild Semiconductor. It utilizes advanced trench technology to achieve low on-state resistance while maintaining superior switching performance. Designed for low voltage and battery-powered applications, the device minimizes in-line power loss and supports fast switching speeds. Key electrical characteristics include a drain-source breakdown voltage of 30V, a continuous drain current of 19A, and an on-resistance of 8mΩ at VGS=10V or 10mΩ at VGS=4.5V.
Verify the manufacturer origin, as Fairchild's semiconductor assets were acquired by ON Semiconductor. Confirm the specific package type matches design requirements. Check RoHS compliance status and ensure the part number suffix corresponds to the desired tape-and-reel quantity. Validate that the sourcing channel provides authentic components with traceable documentation.
Select this component when system architecture requires a 30V N-channel switch with logic-level input compatibility. The low RDS(ON) makes it suitable for applications prioritizing conduction loss reduction. Ensure thermal management aligns with the 19A continuous current rating under expected operating conditions. Consider gate charge specifications if switching frequency impacts overall system efficiency significantly.
This device belongs to the PowerTrench family of MOSFETs, which are engineered for high-performance power switching. The series emphasizes the balance between low static resistance and rapid dynamic response. These components are integral to modern power conversion topologies where space constraints and thermal efficiency are critical design parameters.
Potential substitutes include the FDP6670AL and FDR4420A. Verify pinout compatibility and electrical parameter equivalence before substitution. Ensure the alternative device meets the same logic level drive requirements and thermal dissipation capabilities for the target application.
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