FDMA6023PZT

FET, MOSFET Arrays Overview

The FDMA6023PZT is a dual P-channel MOSFET from onsemi's PowerTrench series, housed in a UMLP-6 surface-mount package. It features a 20V drain-source breakdown voltage and supports a continuous drain current of 3.6A per channel. The device exhibits a maximum on-resistance of 60mΩ at VGS = -4.5V. Gate-source voltage limits are ±8V, with a typical gate charge of 17nC. Operating temperatures range from -55°C to +150°C, with a power dissipation rating of 1.4W.

FET, MOSFET Arrays Feature Summary

• Dual configuration integrates two independent P-channel enhancement-mode transistors within a single compact footprint.
• PowerTrench technology provides low on-resistance for efficient power switching applications.
• UMLP-6 package design facilitates automated surface-mount assembly and reduced board space consumption.

FET, MOSFET Arrays Applications

• Low-voltage DC/DC converter circuits
• Load switch implementations in portable electronics
• Battery protection modules

FET, MOSFET Arrays Procurement Notes

Verify component authenticity through authorized distribution channels due to the End-of-Life status. Request original manufacturer documentation to confirm specifications. Inspect packages for physical integrity upon receipt. Ensure storage conditions comply with moisture sensitivity levels. Validate all incoming parts against official datasheet parameters before integration into production.

FET, MOSFET Arrays Selection Notes

Select this component when a dual P-channel solution is required for 20V systems. Compare on-resistance values against alternative packages for thermal management needs. Verify that the UMLP-6 footprint matches the target PCB layout constraints. Confirm that the 3.6A current rating satisfies peak load requirements without exceeding thermal limits.

FET, MOSFET Arrays Part Context

This part belongs to onsemi's PowerTrench family of low-voltage MOSFETs. The FDMA prefix indicates a dual configuration variant. The Z suffix typically denotes specific tape and reel packaging configurations. This series targets cost-sensitive consumer and industrial applications requiring reliable switching performance.

FET, MOSFET Arrays Replacement Considerations

Check for direct pin-compatible substitutes within the same voltage class. Verify that alternative components meet or exceed the 60mΩ on-resistance specification. Ensure replacement packages support the required SMT assembly process. Confirm thermal characteristics align with existing heat dissipation designs.