FDPC1002S

FET, MOSFET Arrays Overview

The FDPC1002S is a 25V asymmetric dual N-Channel MOSFET from the PowerTrench Power Clip series. It integrates a control MOSFET (Q1) and a synchronous SyncFET (Q2) with an internally connected switch node to optimize layout for synchronous buck converters. Q1 features a maximum on-resistance of 7.3 mΩ at VGS = 4.5 V, while Q2 achieves 2.1 mΩ under identical conditions. The device operates within a junction temperature range of -55°C to +150°C and utilizes low-inductance packaging to minimize switching losses.

FET, MOSFET Arrays Feature Summary

• Integrated internal connection between the switch nodes of the high-side and low-side transistors simplifies PCB routing and reduces parasitic inductance.
• Asymmetric channel design pairs a dedicated control MOSFET with a specialized SyncFET to maximize power efficiency in synchronous rectification applications.
• Low-inductance Power Clip package architecture shortens rise and fall times, significantly reducing switching energy losses.

FET, MOSFET Arrays Applications

• Computing systems requiring efficient voltage regulation
• Communications equipment power stages
• General purpose point-of-load DC/DC conversion

FET, MOSFET Arrays Procurement Notes

Verify component authenticity through authorized Fairchild or onsemi distributors due to industry counterfeiting risks. Confirm datasheet revision status matches the specific lot code. Ensure storage conditions adhere to moisture sensitivity level requirements prior to surface mount assembly.

FET, MOSFET Arrays Selection Notes

Select this component for designs prioritizing minimal switch-node ringing and reduced external snubber requirements. Evaluate thermal resistance parameters against the target copper pad area to ensure adequate heat dissipation. Verify gate drive voltage compatibility with the specified threshold characteristics for optimal conduction performance.

FET, MOSFET Arrays Part Context

Originally manufactured by Fairchild Semiconductor, this part belongs to the PowerTrench Power Clip family designed for high-density power conversion. Following corporate acquisitions, the product line was integrated into onsemi's portfolio. The device represents a specialized solution for optimizing synchronous buck converter footprints and electrical performance.

FET, MOSFET Arrays Replacement Considerations

FDPC8016S: Higher current capability but different pinout and package dimensions.

FET, MOSFET Arrays FAQ

What is the function of the internal switch node connection?

The internal connection between the source of Q1 and the drain of Q2 eliminates the need for external copper traces between these nodes, thereby minimizing parasitic inductance and reducing high-frequency ringing during switching transitions.

How does the SyncFET technology benefit this device?

The SyncFET process embeds a Schottky diode in parallel with the MOSFET body diode. This configuration improves reverse recovery characteristics compared to standard MOSFETs, enhancing overall efficiency in synchronous rectification topologies.

What are the recommended PCB layout practices for thermal management?

Designers should utilize large copper areas on both component and bottom sides for V+ and GND pins. Multiple vias should be used to interconnect ground planes, ensuring efficient heat transfer from the junction to the board rather than relying solely on air cooling.