FDPC8011S-AU01

FET, MOSFET Arrays Overview

The FDPC8011S-AU01 is an asymmetric dual N-channel PowerTrench MOSFET manufactured by onsemi. It utilizes the Power Clip package for enhanced thermal performance and low inductance. Key electrical parameters include a drain-source voltage (Vds) of 25 V, continuous drain current (Id) of 40 A per channel, and a maximum on-resistance (Rds(on)) of 3.9 mΩ at Vgs = 10 V. The device features a gate-source voltage range of ±12 V, a threshold voltage (Vgs(th)) between 1.3 V and 1.5 V, and a total gate charge (Qg) of 67 nC. Operating temperatures range from -55°C to +150°C.

FET, MOSFET Arrays Feature Summary

• Asymmetric dual N-channel configuration optimized for bridge applications
• Power Clip package technology providing superior thermal dissipation and low profile
• Low on-resistance design supporting high efficiency power switching

FET, MOSFET Arrays Applications

• High-side and low-side synchronous rectification in DC-DC converters
• Motor control circuits requiring compact dual-switch solutions
• Load switch applications in portable electronics

FET, MOSFET Arrays Procurement Notes

Verify the specific AU01 suffix against official datasheets to confirm reel packaging specifications. Ensure compatibility with standard SMD reflow profiles. Cross-reference ordering information directly with onsemi documentation to avoid discrepancies in tape-and-reel quantities or handling requirements.

FET, MOSFET Arrays Selection Notes

Select this component when a compact dual-N-channel solution with low Rds(on) is required for 25 V systems. The asymmetric configuration allows for optimized driver requirements. Verify that the 40 A current rating and thermal characteristics meet the specific application's power dissipation needs under expected operating conditions.

FET, MOSFET Arrays Part Context

This part belongs to the FDPC series of asymmetric dual MOSFETs from onsemi. These devices are designed to replace discrete MOSFET pairs in space-constrained designs. The Power Clip package distinguishes them from standard SOIC or DFN packages by offering improved heat transfer capabilities through exposed metal pads.

FET, MOSFET Arrays Replacement Considerations

Direct substitutes within the same family include the FDPC8016S, which offers lower on-resistance but may differ in current ratings. Verify pinout compatibility and thermal resistance values before substitution. Check for equivalent package dimensions to ensure mechanical fit.