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FDPC8013S is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET 2N-CH 30V 13A PWRCLIP-33. Review the specifications below when checking this part for your BOM.
The FDPC8013S is a dual N-channel enhancement-mode MOSFET from onsemi's PowerTrench series, housed in an 8-pin WDFN surface-mount package. It features a drain-source voltage (Vds) of 30 V and a maximum continuous drain current (Id) of 26 A. The device exhibits a typical on-resistance (Rds(on)) of 9.2 mΩ and a forward voltage (Vf) of 0.8 V. Key electrical parameters include a typical gate charge (Qg) of 13 nC at specified Vgs conditions. Operating temperatures range from -55°C to 150°C, with a power dissipation (Pd) rating of 2 W. The component dimensions are 3.4 mm in length and 0.75 mm in height.
Verify the specific ordering suffix and tape/reel specifications against the official datasheet before procurement. Confirm that the requested quantity aligns with standard packaging units to avoid partial reel handling issues. Ensure compliance with RoHS and REACH requirements as stated in the manufacturer's documentation. Cross-reference part numbers with authorized distributors to confirm authenticity and availability status prior to finalizing orders.
Select this component when designing circuits requiring a 30 V dual N-channel MOSFET with moderate current handling capabilities. The 9.2 mΩ Rds(on) makes it suitable for low-voltage, high-efficiency power conversion stages. Consider the 2 W power dissipation limit and thermal resistance characteristics for proper heatsinking or PCB copper area allocation. Verify that the gate drive voltage levels are compatible with the threshold voltage specifications for optimal switching performance.
The FDPC8013S belongs to onsemi's PowerTrench family, which focuses on optimizing the balance between conduction losses and switching speeds. This series utilizes advanced trench gate technology to achieve low on-resistance while maintaining robust avalanche ratings. The WDFN package provides a small footprint ideal for dense PCB layouts in consumer and industrial electronics.
Consult onsemi's official cross-reference tools for verified equivalent parts. Ensure any substitute maintains identical pinout, voltage/current ratings, and package dimensions. Verify thermal performance metrics match the original design constraints.
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