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Product Detailed Parameters
- Description：IGBT MOD 1700V 1390A AGPRIME3-1
- Series：PrimePACK™3
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：2 Independent
- Vce(on) (Max) @ Vge, Ic：2.45V @ 15V, 1000A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-PRIME3-1
- Voltage - Collector Emitter Breakdown (Max)：1700 V
- Current - Collector (Ic) (Max)：1390 A
- Power - Max：6250 W
- Current - Collector Cutoff (Max)：5 mA
- Input Capacitance (Cies) @ Vce：81 pF @ 25 V
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Overview
The FF1000R17IE4S4BOSA2 is a high-power IGBT module from Infineon Technologies, utilizing Trenchstop IGBT4-E4 technology. It features a dual half-bridge configuration within the PrimePACK 3 package. The device supports a collector-emitter voltage of 1700 V and a nominal continuous collector current of 1000 A at 25°C. Typical saturation voltages are 2.0 V for the IGBT and 1.85 V for the anti-parallel diode at 25°C. It operates within a junction temperature range of -40°C to +150°C and utilizes screw mounting.
Feature Summary
- Integrates Trenchstop IGBT4-E4 technology for optimized switching performance and low conduction losses.
- Features a robust PrimePACK 3 housing designed for high thermal cycling capability and reliable power cycling.
- Includes an integrated anti-parallel fast recovery diode in a half-bridge topology.
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the specific suffix BOSA2 against official Infineon documentation to confirm exact manufacturing lot details and compliance status. Ensure the component matches the required PrimePACK 3 footprint and terminal configuration for your assembly process.
Selection Notes
Select this module for applications requiring high current density and robust thermal management. Confirm that the gate drive circuitry accommodates the specific charge requirements of the IGBT4-E4 technology and that the cooling system can handle the specified power dissipation levels.
Part Context
This component belongs to the PrimePACK family, designed for industrial power electronics. It represents an evolution in high-current modules, offering improved reliability compared to previous generations while maintaining compatibility with standard mechanical interfaces.
Replacement Considerations
Direct substitutes include FF1000R17IE4 and FF1000R17IE4BOSA1. Verify electrical parameters and pinout compatibility before substitution, as suffix variations may indicate different packaging or testing standards.
