FF11MR12W2M1HPB11BPSA1

$67.97

Description：MOSFET 1200V
Series：CoolSiC™

SKU:1adff0058378 Category: FET, MOSFET Arrays Brand: Infineon Technologies

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Product introduction

FF11MR12W2M1HPB11BPSA1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET 1200V. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for FF11MR12W2M1HPB11BPSA1

Description：MOSFET 1200V
Series：CoolSiC™
Mfr：Infineon Technologies
Package：Tray
Technology：-
Configuration：-
FET Feature：-
Drain to Source Voltage (Vdss)：1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C：-
Rds On (Max) @ Id, Vgs：-
Vgs(th) (Max) @ Id：-
Gate Charge (Qg) (Max) @ Vgs：-
Input Capacitance (Ciss) (Max) @ Vds：-
Power - Max：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Grade：-
Qualification：-

FET, MOSFET Arrays datasheet and documents for FF11MR12W2M1HPB11BPSA1

FF11MR12W2M1HPB11BPSA1

FET, MOSFET Arrays Overview

The FF11MR12W2M1HPB11BPSA1 is a CoolSiC™ Trench MOSFET half-bridge module in the EasyPACK™ package. It features a 1200 V drain-source voltage and supports a continuous DC drain current of 75 A at 175 °C, with a repetitive peak current of 150 A. The on-state resistance is 10.8 mΩ at 25 °C. The module integrates an NTC thermistor for temperature monitoring and utilizes PressFIT contact technology. It includes pre-applied thermal interface material and integrated mounting clamps for secure installation.

FET, MOSFET Arrays Feature Summary

Integrates CoolSiC™ Trench MOSFET technology for low switching losses and high-frequency operation
Features PressFIT contact technology combined with pre-applied thermal interface material
Includes an integrated NTC temperature sensor for precise thermal management
Designed with rugged mounting clamps to ensure stable mechanical connection

FET, MOSFET Arrays Applications

High-frequency switching applications
DC/DC converters
Motor drives
UPS systems
EV DC chargers

FET, MOSFET Arrays Procurement Notes

Verify the specific ordering suffix BPSA1 against the manufacturer's official documentation to confirm exact configuration details. Ensure that the application environment complies with the industrial qualification standards defined in IEC 60747, 60749, and 60068. Confirm that the gate drive voltage window aligns with the recommended values to maintain long-term device reliability.

FET, MOSFET Arrays Selection Notes

Select this component for designs requiring high efficiency in power conversion due to its low switching energy losses. The integrated NTC sensor simplifies thermal protection circuitry. Verify that the system can accommodate the PressFIT mounting method and that the thermal interface material specifications match the heatsink requirements for optimal heat dissipation.

FET, MOSFET Arrays Part Context

This part belongs to Infineon's EasyPACK™ series utilizing CoolSiC™ technology. It is designed as a compact, high-performance power module suitable for demanding industrial environments. The module combines silicon carbide semiconductors with advanced packaging features to support modern power electronics architectures.

FET, MOSFET Arrays Replacement Considerations

Consult official replacement lists for compatible modules within the EasyPACK™ family. Verify pinout compatibility and electrical ratings before substituting with other variants.