FF1200XTR17T2P5BPSA1

Overview

The FF1200XTR17T2P5 is a dual IGBT module utilizing XHP™2 technology with Trench/Fieldstop IGBT5 and emitter-controlled diodes. It features an integrated NTC thermistor for thermal monitoring. The device supports a collector-emitter voltage of 1700 V, a nominal continuous DC collector current of 1200 A at 175°C junction temperature, and a repetitive peak current of 2400 A. Key electrical parameters include a saturation voltage of 1.80 V (typical) at 25°C and a forward voltage of 1.75 V (typical) for the diode. Thermal resistance from junction to case is 26.8 K/kW for the IGBT and 51.4 K/kW for the diode.

Feature Summary

• High power density design enabled by XHP™2 packaging and advanced semiconductor generation
• Robust mechanical construction with high creepage distances and comparative tracking index exceeding 600
• Integrated NTC thermistor for precise internal temperature monitoring
• Extended operating temperature range supporting up to 175°C junction temperature

Applications

• High-power industrial converters
• Motor drive systems
• Traction drives
• Wind turbine inverters

Procurement Notes

Verify component authenticity through official Infineon channels or authorized distributors. Confirm that the specific ordering suffix matches the required technical specifications. Ensure compliance with industrial qualification standards such as IEC 60747 and IEC 60749 prior to integration into final equipment designs.

Selection Notes

Select this module for applications requiring high current handling and robust thermal cycling capability. Evaluate system requirements against the 1700 V rating and 1200 A continuous current limits. Consider the thermal resistance values when designing heatsinking solutions to maintain junction temperatures within the specified operational range.

Part Context

This component belongs to the XHP™2 module family, designed for high-power industrial applications. It represents an evolution in Infineon's IGBT portfolio, combining high current density with improved switching performance. The module is distinct from automotive-qualified variants and is specifically targeted at industrial environments.

Replacement Considerations

Direct replacements must match the 1700 V / 1200 A rating and XHP™2 package dimensions. Verify compatibility of gate drive requirements and thermal interface materials. Cross-reference pinouts and insulation coordination characteristics to ensure seamless integration into existing PCB layouts.

FAQ

Is this module qualified for automotive applications?

No, the datasheet explicitly states that this product is not qualified according to AEC-Q100 or AEC-Q101 documents.

What is the maximum baseplate operation temperature?

The maximum baseplate operation temperature is 150°C.

Does the module include short-circuit protection features?

The datasheet provides short-circuit data indicating a withstand time of up to 10 µs at 175°C, but it does not list built-in electronic protection circuits.