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Product Detailed Parameters
- Description：PP IHM I
- Series：PrimePACK™
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：Half Bridge Inverter
- Vce(on) (Max) @ Vge, Ic：-
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-PRIME3+
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：2400 A
- Power - Max：-
- Current - Collector Cutoff (Max)：-
- Input Capacitance (Cies) @ Vce：-
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Overview
The FF2400R12IP7PBPSA1 is a half-bridge IGBT module utilizing TRENCHSTOP™ IGBT7 technology in the PrimePACK™3+ package. It features a collector-emitter voltage of 1200 V and a nominal continuous DC collector current of 2400 A at 50°C baseplate temperature, with a repetitive peak current capability of 4800 A. The typical saturation voltage is 1.27 V at 25°C junction temperature. The module includes an integrated NTC thermistor rated at 5 kΩ at 25°C and comes with pre-applied thermal interface material.
Feature Summary
- Integrates TRENCHSTOP™ IGBT7 and emitter controlled 7 diode for high current density and low inductive design
- Includes an integrated NTC thermistor for precise temperature monitoring
- Comes with pre-applied thermal interface material to simplify assembly
- Provides high creepage and clearance distances with 4 kV AC insulation
Applications
- Motor drives
- Industrial applications qualified per IEC 60747, 60749 and 60068
Procurement Notes
Verify the specific ordering suffix against official documentation to confirm exact configuration details. Ensure compliance with industrial qualification standards required for the target application environment. Confirm mechanical mounting torque specifications during integration to maintain electrical isolation integrity and thermal performance.
Selection Notes
Select this component for high-power industrial systems requiring robust current handling and efficient switching characteristics. Consider the operational temperature limits and overload capabilities when designing thermal management solutions. Verify that the gate drive requirements align with the specified internal gate resistance and charge parameters.
Part Context
This part belongs to Infineon's PrimePACK™3+ B-series lineup, designed for high power density applications. It represents the implementation of the seventh generation of TRENCHSTOP™ IGBT technology, offering improvements in conduction and switching losses compared to previous generations within the same form factor.
Replacement Considerations
Direct substitutes are not explicitly listed in the provided datasheet. Evaluate other modules within the PrimePACK™3+ family or different packaging options from the manufacturer based on matching voltage, current ratings, and thermal resistance specifications.
