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The FF300R17ME4B11BOSA1 is a dual IGBT module from Infineon Technologies, utilizing Trenchstop IGBT4-E4 technology within the EconoDUAL PressFIT package. It features a half-bridge topology with an integrated freewheeling diode and a built-in thermistor for thermal monitoring. The device supports a collector-emitter voltage (VCES) of 1700 V and a nominal continuous collector current (IC) of 300 A at 25°C. Key electrical parameters include a typical saturated collector-emitter voltage (VCE(sat)) of 1.95 V and a forward voltage (VF) of 1.8 V at 25°C. The module operates within a junction temperature range of -40°C to +150°C.
Verify the specific ordering suffix BOSA1 against official Infineon documentation to confirm component revision and compliance status. Ensure that procurement channels provide valid traceability data. Cross-reference the part number with the manufacturer's latest lifecycle notifications to confirm active production status before finalizing orders.
Select this module for applications requiring high current density and robust mechanical mounting without soldering. Verify that the host system design accommodates the specific dimensions of the EconoDUAL PressFIT form factor. Confirm that the gate drive circuitry matches the electrical characteristics of the IGBT4-E4 generation.
This component belongs to the Infineon EconoDUAL family, specifically utilizing the PressFIT variant which replaces traditional screw or solder terminals. It represents an evolution in industrial power modules, focusing on improved assembly reliability and thermal management capabilities compared to earlier generations.
Direct replacement requires verifying pinout compatibility and mechanical footprint alignment. Consider the FF300R17ME4_B11 as a related variant, noting differences in terminal technology and packaging specifications between PressFIT and standard configurations.
The 'B' suffix indicates the inclusion of a built-in NTC thermistor for junction temperature monitoring.
No, it utilizes the PressFIT termination system, which uses spring-loaded pins for connection to the PCB.
The maximum operating junction temperature is +150°C.