FF400R07A01E3S6XKSA2

Overview

The FF400R07A01E3_S6 is a half-bridge IGBT module from Infineon Technologies, utilizing Trench-Field-Stop technology within the HybridPACK DSC S1 package. It features a collector-emitter voltage (VCES) of 700 V and a nominal continuous DC collector current (IC nom) of 400 A at TC = 75°C with a maximum junction temperature of 175°C. The module incorporates an integrated on-die current sensor and temperature sensor for precise state monitoring. Electrical characteristics include a typical VCE sat of 1.65 V at Tvj = 25°C and a total power dissipation (Ptot) of 1500 W. Thermal resistance from junction to case (RthJC) is 0.100 K/W per IGBT and 0.150 K/W per diode under double-sided cooling conditions.

Feature Summary

• Integrated on-die current and temperature sensors enable precise monitoring and enhanced protection.
• Double-sided cooling design provides superior thermal performance and compact form factor.
• Low inductive design supports high efficiency systems with increased blocking voltage capability.

Applications

• Hybrid electric vehicles (HEV)
• Electric vehicles (EV)
• Automotive high-power inverters

Procurement Notes

Verify the specific ordering code SP001661226 against official Infineon documentation to ensure correct component identification. Confirm that the required automotive qualification standards are met for the intended application environment. Check for any updates regarding the product lifecycle status or recommended replacement parts before finalizing procurement plans.

Selection Notes

Select this module for applications requiring a 700 V rating and 400 A continuous current capability. Ensure the system design accommodates the double-sided cooling requirement to achieve the specified thermal resistance values. Consider the integrated sensor outputs when designing the gate driver and control circuitry for overcurrent and thermal management.

Part Context

This component belongs to the HybridPACK DSC S1 series, designed specifically for automotive traction inverters. It represents Infineon's Trench-Field-Stop IGBT technology optimized for high power density. The module integrates advanced sensing capabilities directly onto the die, distinguishing it from standard discrete modules by providing real-time internal state feedback.

Replacement Considerations

Consult official Infineon resources for direct replacements. Verify compatibility with existing cooling interfaces and pin assignments if substituting with other HybridPACK variants.