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Product Detailed Parameters
- Description：IGBT MOD 3300V 450A AGXHP100-3
- Series：XHP™3
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：2.75V @ 15V, 450A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 150°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-XHP100-3
- Voltage - Collector Emitter Breakdown (Max)：3300 V
- Current - Collector (Ic) (Max)：450 A
- Power - Max：1000000 W
- Current - Collector Cutoff (Max)：5 mA
- Input Capacitance (Cies) @ Vce：-
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Overview
The FF450R33T3E3P3BPMA1 is a high-voltage IGBT module manufactured by Infineon Technologies, belonging to the Trenchstop IGBT3 - E3 series. It features a dual configuration housed in an AG-XHP100-3 package designed for screw mounting. The component utilizes silicon technology and supports a maximum collector-emitter voltage of 3.3 kV with a continuous collector current of 450 A at 25°C. Key electrical parameters include a typical collector-emitter saturation voltage of 2.5 V and a gate-emitter leakage current of 400 nA. The module operates within a temperature range of -40°C to +150°C and has a power dissipation rating of 1 MW.
Feature Summary
- High-voltage capability up to 3.3 kV suitable for demanding industrial applications
- Robust thermal management through the XHP package design
- Integrated protection features inherent to the Trenchstop IGBT3 technology
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the specific suffix P3BPMA1 against official Infineon documentation to confirm exact packaging and variant details, as distributor listings may vary. Ensure compliance with export regulations if applicable. Cross-reference the datasheet revision to match your design requirements precisely before finalizing orders.
Selection Notes
Select this module for applications requiring high current handling at elevated voltages. Consider the 3.3 kV rating and 450 A current capacity when designing thermal management solutions. Verify that the AG-XHP100-3 package dimensions fit the mechanical constraints of the target system.
Part Context
This part belongs to Infineon's Trenchstop IGBT3 family, which offers optimized switching characteristics and robustness. The XHP package provides enhanced thermal performance compared to standard modules, making it suitable for high-power density designs in industrial power electronics.
Replacement Considerations
Check for direct substitutes within the same XHP series or compatible packages. Ensure any replacement maintains the 3.3 kV voltage rating and similar current capabilities to avoid redesigning the thermal and electrical interfaces.
