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The FF750R17ME7DB11BPSA1 is a dual IGBT module from Infineon Technologies, utilizing TRENCHSTOP™ IGBT7 technology within the EconoDUAL™3 package. It features an isolated copper baseplate and PressFIT contact technology. The device supports a collector-emitter voltage of 1700 V with a continuous DC collector current of 750 A at 25°C. Key electrical parameters include a typical saturation voltage of 1.70 V and a maximum repetitive peak collector current of 1500 A. The integrated NTC thermistor has a rated resistance of 5 kΩ at 25°C. Operating junction temperatures range from -40°C to +175°C.
Verify component authenticity by cross-referencing the Data Matrix barcode on the module label with official Infineon records. Confirm that the specific ordering suffix matches the required technical specifications, as variations may exist within the product family. Ensure compliance with industrial qualification standards such as IEC 60747 and IEC 60068 prior to integration into final designs.
Select this module for applications requiring high current density and robust short-circuit withstand capability up to 2600 A. Consider the 1700 V rating for medium-voltage systems. Evaluate thermal management requirements based on the specified thermal resistance values. Verify compatibility with recommended gate drivers listed in the Infineon Gate Driver Finder tool to ensure optimal switching performance.
This component belongs to the EconoDUAL™3 series, representing a generation of high-performance power modules. It succeeds previous generations by incorporating TRENCHSTOP™ IGBT7 technology, which offers improved efficiency and switching characteristics compared to older silicon technologies. The standardized housing facilitates mechanical interchangeability within compatible system architectures.
Direct substitutes are not explicitly confirmed in public documentation. When evaluating alternatives, verify matching voltage ratings (1700 V), current capabilities (750 A), and package dimensions. Ensure the replacement utilizes compatible PressFIT technology or requires appropriate adapter solutions for existing PCB layouts.
The NTC thermistor provides real-time temperature monitoring of the module, allowing for precise thermal management and protection against overheating during operation.
PressFIT technology allows for solder-free mounting, which reduces manufacturing complexity, eliminates soldering defects, and lowers overall assembly costs while ensuring reliable electrical connections.
Yes, the module features an enlarged emitter-controlled diode specifically designed to handle regenerative energy flow efficiently, making it suitable for applications like motor drives with braking capabilities.