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The FF750R17ME7DPB11BPSA1 is an EconoDUAL™3 IGBT module featuring TRENCHSTOP™ IGBT7 technology and emitter-controlled diodes. It provides a collector-emitter voltage (VCES) of 1700 V, a nominal continuous DC collector current (ICDC) of 650 A at 45 °C heatsink temperature, and a repetitive peak collector current (ICRM) of 1500 A. The module incorporates PressFIT contact technology for terminal connections and includes an integrated NTC thermistor with a rated resistance of 5 kΩ at 25 °C. Pre-applied thermal interface material is included to facilitate mounting.
Verify the specific ordering suffix DP_B11 against official Infineon documentation to confirm the inclusion of PressFIT contacts and pre-applied TIM. Ensure that the selected gate driver is compatible with the module's electrical requirements as listed in the manufacturer's gate driver finder tool. Confirm compliance with industrial qualification standards such as IEC 60747 prior to final procurement.
Select this component for applications requiring high current density and robust overload capabilities up to 175 °C junction temperature. Consider the 1700 V rating and 1500 A peak current capability when designing for medium-voltage environments. Verify that the system layout accommodates the standard EconoDUAL™3 housing dimensions and utilizes the recommended mounting torque specifications for optimal thermal performance.
This module belongs to the EconoDUAL™3 series from Infineon Technologies, utilizing the seventh generation of TRENCHSTOP™ IGBT technology. The product line is designed for industrial power electronics, offering high reliability and compact packaging. The specific model integrates advanced switching characteristics with mechanical features like isolated base plates and standardized housing formats.
Consult the official Infineon cross-reference documentation or application notes for verified substitute part numbers. Do not assume functional equivalence based solely on package dimensions or voltage ratings. Verify that any alternative component matches the specific PressFIT pin configuration and thermal interface requirements.
The module supports an operating junction temperature range from -40 °C to 175 °C. Operation above 150 °C is permitted only under overload conditions.
The module utilizes PressFIT contact technology for terminal connections, allowing for solderless mounting onto the PCB.
Yes, the module includes an integrated NTC thermistor with a rated resistance of 5 kΩ at 25 °C for thermal monitoring.