FF8MR12W1M1HB11BPSA1

FET, MOSFET Arrays Overview

The FF8MR12W1M1H_B11 is an EasyDUAL module featuring CoolSiC™ Trench MOSFET technology with PressFIT contacts and an integrated NTC sensor. It offers a drain-source voltage of 1200 V, nominal drain current of 100 A, and repetitive peak current of 200 A. The device exhibits low stray inductance (9 nH) and low switching losses. Key electrical parameters include a typical on-resistance of 8.1 mΩ at 25°C and a gate threshold voltage of 4.3 V. The module supports junction temperatures up to 175°C and includes rugged mounting clamps for secure installation.

FET, MOSFET Arrays Feature Summary

• Utilizes CoolSiC™ Trench MOSFET technology for high-frequency switching efficiency
• Features PressFIT contact technology for reliable mechanical and electrical connections
• Includes an integrated NTC temperature sensor for precise thermal monitoring
• Designed with low inductive structure to minimize switching losses and voltage spikes

FET, MOSFET Arrays Applications

• High-frequency switching applications
• DC/DC converters
• Uninterruptible Power Supply (UPS) systems
• DC chargers for electric vehicles

FET, MOSFET Arrays Procurement Notes

Verify the specific ordering suffix B11 against the manufacturer's latest documentation to ensure compatibility with required insulation coordination and terminal configurations. Confirm that the application environment meets the specified industrial qualification standards defined in IEC 60747, 60749, and 60068 prior to integration into final designs.

FET, MOSFET Arrays Selection Notes

Select this module for designs requiring high voltage tolerance and low switching losses in compact form factors. Consider the 1200 V rating and 100 A continuous current capability when sizing thermal management solutions. Ensure gate drive voltages align with the recommended 15-18 V range to optimize performance and longevity of the silicon carbide components.

FET, MOSFET Arrays Part Context

This component belongs to Infineon's EasyDUAL series, which integrates power semiconductors in a single package to simplify assembly. The B11 variant specifically denotes the inclusion of PressFIT terminals and an NTC thermistor, distinguishing it from other variants in the FFxxMR12W1M1H family that may use different connection technologies or lack thermal sensing features.

FET, MOSFET Arrays Replacement Considerations

Consult official substitution lists for compatible modules within the FFxxMR12W1M1H series. Verify pinout compatibility and thermal resistance values before replacing existing units to ensure system integrity without redesigning the cooling infrastructure.

FET, MOSFET Arrays FAQ

What is the maximum operating junction temperature for this module?

The module supports an operating junction temperature range up to 175°C.

Does the module include thermal protection features?

Yes, it includes an integrated NTC thermistor for temperature monitoring, but it does not contain active circuitry for automatic shutdown.

What type of terminal connection does this part use?

It utilizes PressFIT contact technology for mounting and electrical connection.