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Product Detailed Parameters
- Description：IGBT MOD 1200V 900A 5100W
- Series：PrimePACK™2
- Mfr：Infineon Technologies
- Package：Bulk,Tray
- IGBT Type：Trench Field Stop
- Configuration：2 Independent
- Vce(on) (Max) @ Vge, Ic：2.05V @ 15V, 900A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：900 A
- Power - Max：5100 W
- Current - Collector Cutoff (Max)：5 mA
- Input Capacitance (Cies) @ Vce：54 nF @ 25 V
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Overview
The FF900R12IP4VBOSA1 is a dual IGBT module from Infineon Technologies, utilizing Trench/Fieldstop IGBT4 technology. It features a 1200 V collector-emitter voltage and a continuous collector current of 900 A. The module integrates Emitter Controlled 4 diodes and an NTC sensor for thermal monitoring. Packaged in the PrimePACK2 form factor, it is designed for chassis mounting. This component represents a high-power silicon solution intended for demanding industrial power conversion applications requiring robust switching performance.
Feature Summary
- Integrates Trench/Fieldstop IGBT4 technology with Emitter Controlled 4 diodes for optimized switching characteristics.
- Includes an integrated NTC thermistor for precise internal temperature monitoring and thermal management.
- Utilizes the PrimePACK2 packaging design to facilitate efficient chassis mounting and heat dissipation.
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Welding inverters
Procurement Notes
Verify the specific suffix 'V' against official Infineon documentation to confirm the exact variant configuration, as ordering suffixes may denote specific internal revisions or testing criteria not always detailed in general summaries. Ensure compatibility with PrimePACK2 compatible gate drivers and cooling systems. Cross-reference the datasheet revision date to confirm the technical specifications align with current production standards before finalizing procurement orders.
Selection Notes
Select this module for applications requiring high current handling at 1200 V ratings within a compact footprint. The inclusion of Emitter Controlled diodes aids in reducing reverse recovery losses compared to standard fast recovery diodes. Consider the PrimePACK2 mechanical dimensions for PCB or chassis layout constraints. Verify that the thermal interface material and mounting torque specifications meet the requirements for reliable long-term operation under high load conditions.
Part Context
This component belongs to the Trench/Fieldstop IGBT4 product family, which combines trench gate technology with field-stop layer architecture to enhance efficiency and switching speed. The PrimePACK series is designed for high-power density applications, offering standardized mechanical interfaces that simplify integration into various power electronic systems compared to discrete components or older module generations.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided source data. Consult official Infineon replacement guides for cross-referencing similar modules within the IGBT4 family or newer generations such as IGBT7, ensuring electrical parameters and mechanical footprints remain compatible with the existing system design.
