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The FF900R17ME7B11BPSA1 is a dual IGBT module from Infineon Technologies, utilizing TRENCHSTOP™ IGBT7 technology within the EconoDUAL™3 housing. It features a collector-emitter voltage of 1700 V and a continuous DC collector current of 900 A at 25°C case temperature. The device incorporates an integrated NTC thermistor with a rated resistance of 5 kΩ at 25°C. Key electrical parameters include a typical saturation voltage of 1.70 V and a maximum repetitive peak collector current of 1800 A. The module supports overload operation up to a junction temperature of 175°C.
Verify component authenticity by cross-referencing the Data Matrix barcode on the module label against official Infineon records. Ensure the ordering suffix matches the specific variant required. Confirm that the application environment complies with the specified insulation coordination and thermal management guidelines outlined in the datasheet.
Select this module for applications requiring high current handling and elevated junction temperatures. Verify gate driver compatibility using the Infineon Gate Driver Finder tool. Ensure the cooling system maintains the case temperature within limits to support the 900 A rating. Check creepage and clearance distances against the installation requirements.
This component belongs to the EconoDUAL™3 family, designed for industrial applications. It represents the 1700 V generation utilizing TRENCHSTOP™ IGBT7 chips. The module is qualified according to IEC standards for industrial use. It serves as a core switching element in high-performance power electronics systems.
Direct substitutes within the same series include the FF750R17ME7B11BPSA1 and FF225R17ME7B11BPSA1. These variants share identical packaging and pinout configurations but differ in current ratings. Verify thermal characteristics and switching losses before implementation.
The module supports operation up to 175°C. Temperatures above 150°C are permitted only under overload conditions.
An integrated NTC thermistor is included, featuring a rated resistance of 5 kΩ at 25°C and a B-value of 3375 K (B25/50).
The module utilizes PressFIT contact technology for terminal connections, eliminating the need for soldering.