FGH50N3

FGH50N3

  • Description:IGBT PT 300V 75A TO-247-3
  • Series:-

SKU:d7a6d28ce920 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT PT 300V 75A TO-247-3
  • Series:-
  • Mfr:onsemi
  • Package:Tube
  • IGBT Type:PT
  • Voltage - Collector Emitter Breakdown (Max):300 V
  • Current - Collector (Ic) (Max):75 A
  • Current - Collector Pulsed (Icm):240 A
  • Vce(on) (Max) @ Vge, Ic:1.4V @ 15V, 30A
  • Power - Max:463 W
  • Switching Energy:130µJ (on), 92µJ (off)
  • Input Type:Standard
  • Gate Charge:180 nC
  • Td (on/off) @ 25°C:20ns/135ns
  • Test Condition:180V, 30A, 5Ohm, 15V
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-247-3
  • Supplier Device Package:TO-247-3
  • Grade:-
  • Qualification:-

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FGH50N3

Overview

The onsemi FGH50N3 is a planar technology N-channel Insulated Gate Bipolar Transistor (IGBT) designed for high-frequency switching applications requiring low conduction losses. It features a maximum collector-emitter voltage of 300 V and a continuous collector current of 75 A at 25°C case temperature. The device operates within a junction temperature range of -55°C to +150°C and is housed in a TO-247-3LD short lead package with flange mount installation.

Feature Summary

  • Optimized for medium frequency switch mode power supplies
  • Low saturation voltage and turn-off energy loss
  • Positive temperature coefficient above 50 A
  • High ruggedness with defined short circuit withstand time

Applications

  • Switch Mode Power Supplies (SMPS)
  • Power conditioning circuits
  • Uninterruptible power supply systems

Procurement Notes

Verify the specific ordering suffix against official documentation, as variations may exist. Confirm that the component meets RoHS compliance standards if required by your manufacturing process. Ensure thermal management solutions are compatible with the TO-247-3LD package dimensions and mounting requirements specified in the datasheet.

Selection Notes

Select this IGBT when designing circuits operating at medium frequencies where minimizing conduction losses is critical. Consider the 300 V breakdown voltage and 75 A current rating to ensure adequate headroom for your application's peak loads. Evaluate the thermal resistance characteristics to determine appropriate heatsinking for sustained operation.

Part Context

This component belongs to onsemi's discrete IGBT portfolio, specifically engineered for high-voltage switching. It utilizes planar technology to achieve performance metrics suitable for modern power electronics. The device is distinct from MOSFETs due to its bipolar conduction mechanism, offering lower on-state voltage drops at higher currents.

Replacement Considerations

When substituting this part, verify that the replacement device matches the 300 V collector-emitter voltage rating and provides comparable continuous current capabilities. Ensure the new component fits the TO-247-3LD footprint and maintains similar switching speed characteristics to preserve circuit timing and efficiency.

FAQ

What is the maximum short circuit withstand time for the FGH50N3?

The device has a short circuit withstand time of 8 microseconds at a junction temperature of 125°C.

Does the FGH50N3 exhibit positive temperature coefficients?

Yes, the collector-emitter saturation voltage exhibits a positive temperature coefficient above 50 A, which aids in parallel operation.

What is the typical turn-off energy loss per ampere?

The turn-off energy loss is optimized to be approximately 6.6 microjoules per ampere under standard test conditions.

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