FP150R07N3E4PB11BPSA1

$103.88

Description：LOW POWER ECONO AG-ECONO3-3
Series：EconoPIM™ 3

SKU:cbbb49cd97b0 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：LOW POWER ECONO AG-ECONO3-3
Series：EconoPIM™ 3
Mfr：Infineon Technologies
Package：Bulk,Tray
IGBT Type：Trench Field Stop
Configuration：Three Phase Inverter
Vce(on) (Max) @ Vge, Ic：1.95V @ 15V, 150A
Input：Three Phase Bridge Rectifier
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：AG-ECONO3
Voltage - Collector Emitter Breakdown (Max)：650 V
Current - Collector (Ic) (Max)：150 A
Power - Max：430 W
Current - Collector Cutoff (Max)：1 mA
Input Capacitance (Cies) @ Vce：9.3 nF @ 25 V

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FP150R07N3E4PB11BPSA1

Overview

The FP150R07N3E4PB11BPSA1 is a silicon IGBT module from Infineon Technologies, belonging to the Trench/Fieldstop IGBT4 - E4 series. It utilizes the EconoPIM PressFIT package and features a 3-Phase Inverter configuration. Key electrical parameters include a maximum collector-emitter voltage (VCEO) of 650 V and a continuous collector current of 150 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.55 V and a gate-emitter leakage current of 400 nA. Power dissipation is rated at 430 W, with an operating temperature range spanning from -40°C to +150°C.

Feature Summary

Integrates Trench/Fieldstop IGBT4 technology for optimized switching performance
Features EconoPIM PressFIT packaging for direct board mounting
Includes integrated NTC thermistor for precise thermal monitoring

Applications

Three-phase inverter circuits
Industrial motor drives
Power supply systems

Procurement Notes

Verify component authenticity through official Infineon channels or authorized distributors. Confirm RoHS compliance status prior to integration. Ensure handling procedures align with moisture sensitivity level requirements. Cross-reference datasheet specifications against application constraints to validate suitability for the intended operational environment.

Selection Notes

Select this module for applications requiring high current density and efficient thermal management within a compact footprint. The PressFIT interface simplifies assembly compared to traditional screw-mounted alternatives. Evaluate thermal resistance characteristics against system cooling capabilities to ensure reliable operation under maximum load conditions.

Part Context

This component is part of Infineon's EconoPIM family, designed for high-power density applications. It represents an evolution in IGBT module design, combining robust electrical performance with mechanical simplicity. The specific model targets industrial markets demanding reliable three-phase power conversion solutions.