FS03MR12A6MA1BBPSA1

$1,703.60

Description：MOSFET 6N-CH 1200V AG-HYBRIDD
Series：HybridPACK™

SKU:fe165349da91 Category: FET, MOSFET Arrays Brand: Infineon Technologies

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Product introduction

FS03MR12A6MA1BBPSA1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET 6N-CH 1200V AG-HYBRIDD. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for FS03MR12A6MA1BBPSA1

Description：MOSFET 6N-CH 1200V AG-HYBRIDD
Series：HybridPACK™
Mfr：Infineon Technologies
Package：Tray
Technology：Silicon Carbide (SiC)
Configuration：6 N-Channel (3-Phase Bridge)
FET Feature：-
Drain to Source Voltage (Vdss)：1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C：400A (Tj)
Rds On (Max) @ Id, Vgs：3.7mOhm @ 400A, 15V
Vgs(th) (Max) @ Id：5.55V @ 240mA
Gate Charge (Qg) (Max) @ Vgs：1320nC @ 15V
Input Capacitance (Ciss) (Max) @ Vds：42500pF @ 600V
Power - Max：-
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：AG-HYBRIDD-2
Grade：-
Qualification：-

FET, MOSFET Arrays datasheet and documents for FS03MR12A6MA1BBPSA1

FS03MR12A6MA1BBPSA1

FET, MOSFET Arrays Overview

The FS03MR12A6MA1BBPSA1 is a HybridPACK Drive module utilizing CoolSiC Automotive MOSFET technology. It features a 1200 V drain-source voltage and a nominal DC drain current of 400 A at 60 °C case temperature. The device incorporates a direct-cooled PinFin base plate with a thermal resistance of 0.108 K/W. Electrical characteristics include a maximum on-resistance of 4.55 mΩ at 150 °C, low stray inductance below 10 nH, and an integrated NTC thermistor for temperature monitoring.

FET, MOSFET Arrays Feature Summary

Utilizes Silicon Carbide semiconductor material to achieve low on-resistance and reduced switching losses.
Features a direct-cooled PinFin base plate design that enables high power density and efficient thermal management.
Incorporates press-fit contact technology and guiding elements to simplify PCB and cooler assembly.
Includes an integrated NTC temperature sensor for precise junction temperature monitoring.

FET, MOSFET Arrays Applications

Hybrid Electric Vehicles (HEV)
Electric Vehicle Motor Drives
Commercial Agriculture Vehicles

FET, MOSFET Arrays Procurement Notes

Verify the component status before integration into new designs. Official documentation indicates this specific part number is marked as Not Recommended for New Designs. Confirm availability through authorized distributors and ensure compliance with automotive qualification standards such as AQG324 during the validation phase.

FET, MOSFET Arrays Selection Notes

Select this module for applications requiring high efficiency and compact packaging in electric drive systems. The low stray inductance supports high-frequency switching operations. Ensure the cooling system maintains the fluid temperature at 60 °C to sustain the rated 400 A continuous current capability.

FET, MOSFET Arrays Part Context

This component belongs to the Infineon HybridPACK Drive family, specifically designed for automotive traction inverters. It represents a generation of silicon carbide modules optimized for high power density and reliability in demanding vehicular environments.