FS150R12N2T7BPSA2

Overview

The FS150R12N2T7BPSA2 is a six-pack IGBT module utilizing TRENCHSTOP™ IGBT7 technology and Emitter Controlled 7 diodes within an EconoPACK™2 package. It features a 1200 V collector-emitter voltage rating and a continuous DC collector current of 150 A at a case temperature of 80 °C. The module incorporates an integrated NTC thermistor with a rated resistance of 5 kΩ at 25 °C for thermal monitoring. Electrical characteristics include a typical saturation voltage of 1.55 V and a forward voltage of 1.72 V at 25 °C. The device supports overload operation up to a junction temperature of 175 °C and utilizes solder contact technology with a copper baseplate.

Feature Summary

• Integrates TRENCHSTOP™ IGBT7 technology with Emitter Controlled 7 diodes for optimized switching performance.
• Includes an embedded NTC temperature sensor for reliable thermal management.
• Constructed with an Al2O3 substrate and copper baseplate to ensure low thermal resistance.
• Designed for high power cycling capability and robust mechanical stability.

Applications

• Motor drives
• Auxiliary inverters
• Servo drives

Procurement Notes

Verify the specific suffix BPSA2 against official documentation to confirm packaging or handling specifications, as datasheets may reference the base model FS150R12N2T7. Ensure compliance with industrial qualification standards such as IEC 60747 and IEC 60068. Confirm that the application environment remains within the specified storage and operating temperature ranges defined in the product validation section.

Selection Notes

Select this component for industrial applications requiring a 1200 V rating and 150 A continuous current capacity. The module is suitable for designs needing high thermal efficiency due to its low thermal resistance characteristics. Consider the maximum junction temperature limit of 175 °C when designing thermal management systems. Verify that the gate drive requirements align with the specified internal gate resistor and voltage limits.

Part Context

This module belongs to the EconoPACK™2 family from Infineon Technologies, designed for low- and medium-power industrial applications. It represents the TRENCHSTOP™ IGBT7 generation, offering improved power density compared to previous technologies. The six-pack topology integrates three half-bridge legs into a single compact unit, simplifying assembly and reducing parasitic inductance in inverter circuits.

Replacement Considerations

Consult official substitution lists for compatible modules within the EconoPACK™2 series. Verify pin compatibility and thermal resistance values before replacing existing components. Ensure that any substitute part meets the same voltage and current ratings required by the original design specifications.