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Product Detailed Parameters
- Description：MOD IGBT LOW PWR EASY750-1
- Series：-
- Mfr：Infineon Technologies
- Package：Bulk,Tray
- IGBT Type：-
- Configuration：-
- Vce(on) (Max) @ Vge, Ic：-
- Input：-
- NTC Thermistor：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：-
- Current - Collector (Ic) (Max)：-
- Power - Max：-
- Current - Collector Cutoff (Max)：-
- Input Capacitance (Cies) @ Vce：-
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Overview
The FS15R06VL4B2BOMA1 is a silicon IGBT module from Infineon Technologies, belonging to the IGBT3 series and utilizing the EasyPACK trademark packaging. It features a six-pack configuration designed for surface mount installation. The component operates within a temperature range of -40°C to +150°C. Official documentation lists this part number as having restricted supply status or being discontinued, with specific electrical parameters such as collector-emitter voltage and current not detailed in the provided source text.
Feature Summary
- Six-pack IGBT configuration
- EasyPACK surface mount package
- IGBT3 technology platform
Applications
- General purpose power switching applications requiring compact form factors
- Industrial motor drive circuits
- Inverter topologies compatible with EasyPACK mounting standards
Procurement Notes
Verify current availability status directly with authorized distributors or Infineon, as the component is listed with restricted supply or end-of-life indicators. Confirm that the BOMA1 suffix corresponds to the exact required specification, as ordering suffixes can alter functional attributes or packaging details. Ensure compliance with RoHS and REACH requirements before integration into final designs.
Selection Notes
Select this module when a six-pack IGBT topology is required in a low-profile surface mount package. Compare thermal resistance and saturation voltage against similar EasyPACK variants if higher current capacity is needed. Verify gate driver compatibility with standard IGBT3 interface requirements. Consider alternative active parts if long-term supply stability is critical for the production lifecycle.
Part Context
This component belongs to the Infineon IGBT3 product family, which utilizes trench-stop technology for optimized switching performance. The EasyPACK series provides a standardized mechanical footprint for various power ratings, facilitating PCB layout consistency across different modules within the same manufacturer's portfolio.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided data. Consult Infineon's official cross-reference tools or datasheets for equivalent models within the IGBT3 or newer generations that match the required voltage, current, and package specifications.
