FS200R12KT4RPB11BPSA1

Overview

The FS200R12KT4RP_B11 is a six-pack IGBT module from Infineon Technologies, utilizing Trench/Fieldstop IGBT4 technology within an EconoPACK™3 housing. It features emitter-controlled diodes and an integrated NTC thermistor with pre-applied thermal interface material. Key electrical parameters include a collector-emitter voltage (Vces) of 1200 V, a continuous DC collector current (Icdc) of 200 A at 60°C heatsink temperature, and a repetitive peak current (Icrm) of 400 A. The module operates with a maximum junction temperature of 150°C under switching conditions and utilizes PressFIT contact technology for mounting.

Feature Summary

• Trench/Fieldstop IGBT4 technology combined with emitter-controlled diodes for low switching losses and low saturation voltage.
• PressFIT contact technology enabling robust mechanical connection without soldering.
• Integrated NTC temperature sensor for precise thermal monitoring.
• Pre-applied thermal interface material to simplify assembly and ensure consistent thermal performance.

Applications

• Auxiliary inverters
• Motor drives
• Servo drives

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm the inclusion of PressFIT contacts and pre-applied thermal interface material. Ensure that the procurement specifications align with the industrial application validation standards defined in the datasheet. Confirm compatibility with the required PCB hole patterns and mounting torque specifications before finalizing orders.

Selection Notes

Select this component for applications requiring high power density and reliable thermal cycling capability. Consider the positive temperature coefficient of the saturation voltage for easy parallel operation. Evaluate the stray inductance and gate charge requirements against the intended driver circuit capabilities. Verify that the operating environment remains within the specified storage and operational temperature ranges.

Part Context

This module belongs to the EconoPACK™3 series, designed for compact and efficient power conversion systems. It represents the Trench/Fieldstop IGBT4 generation, offering improved efficiency compared to previous technologies. The product is validated for industrial applications according to relevant IEC standards, ensuring reliability in demanding environments.

Replacement Considerations

Direct replacements must match the 1200 V rating, 200 A current capacity, and EconoPACK™3 footprint. Verify if alternative modules support PressFIT technology or require different mounting procedures. Check for equivalent switching characteristics and thermal resistance values to maintain system performance.

FAQ

What is the maximum baseplate operation temperature?

The maximum baseplate operation temperature is 125°C.

Does the module include an integrated temperature sensor?

Yes, the module includes an integrated NTC thermistor with a rated resistance of 5 kΩ at 25°C.

What contact technology does this module use?

The module uses PressFIT contact technology for mounting.