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Product Detailed Parameters
- Description：EASY STANDARD
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：-
- Vce(on) (Max) @ Vge, Ic：-
- Input：-
- NTC Thermistor：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：-
- Current - Collector (Ic) (Max)：-
- Power - Max：-
- Current - Collector Cutoff (Max)：-
- Input Capacitance (Cies) @ Vce：-
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Overview
The FS33MR12W1M1HB70BPSA1 is a CoolSiC™ six-pack MOSFET module in the EasyPACK™ 1B package. It features a 1200 V drain-source voltage and a continuous DC drain current of 25 A at 175 °C junction temperature. The typical on-state resistance is 32.3 mΩ at 25 °C, rising to 60.2 mΩ at 150 °C. The module utilizes PressFIT contact technology and includes an integrated NTC thermistor with a rated resistance of 5 kΩ at 25 °C. Operating temperatures range from -40 °C to +150 °C.
Feature Summary
- Six-pack configuration utilizing CoolSiC™ Trench MOSFET technology for high-frequency switching applications.
- PressFIT contact technology combined with integrated mounting clamps for rugged mechanical installation.
- AlN substrate design providing low thermal resistance and basic insulation compliance.
- Integrated NTC temperature sensor for precise thermal monitoring within the module.
Applications
- High-frequency switching applications
- DC/DC converters
- Motor drives
- UPS systems
Procurement Notes
Verify component authenticity by checking the Data Matrix barcode against Infineon standards. Confirm that the ordering suffix matches the specific BPSA1 variant requirements. Ensure compatibility with recommended gate drivers listed in the official GDFinder tool before finalizing procurement orders.
Selection Notes
Select this module for designs requiring low stray inductance and high efficiency in power conversion. Verify that the application supports the specified 1200 V rating and 25 A continuous current limits. Consider the thermal management requirements associated with the AlN substrate and ensure the cooling solution maintains the junction temperature within the operational range.
Part Context
This component belongs to the EasyPACK™ 1B series from Infineon Technologies. It is part of the broader CoolSiC™ portfolio designed for industrial power electronics. The module integrates multiple switches into a single compact unit to reduce system complexity and improve overall performance in three-phase or multi-leg converter topologies.
Replacement Considerations
Consult the official Infineon product selection guide for verified substitutes. Cross-reference pinouts and electrical ratings when considering alternative packages such as HybridPACK or EconoDUAL. Ensure any replacement maintains the same voltage class and thermal characteristics.
FAQ
What is the maximum transient gate-source voltage allowed?
The maximum transient gate-source voltage (VGS D) is limited to -10 V / +23 V with a duty cycle less than 0.01.
How does the on-resistance change with temperature?
The typical RDS(on) increases from 32.3 mΩ at 25 °C to 60.2 mΩ at 150 °C under standard test conditions.
What is the purpose of the integrated NTC thermistor?
The integrated NTC thermistor provides real-time temperature monitoring with a rated resistance of 5 kΩ at 25 °C to assist in thermal management.
