FS3L25R12W2H3PB11BPSA1

$52.91

Description：LOW POWER EASY
Series：-

SKU:e7dc29426065 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：LOW POWER EASY
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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FS3L25R12W2H3PB11BPSA1

Overview

The FS3L25R12W2H3PB11BPSA1 is a 1200 V, 25 A three-level IGBT module from Infineon Technologies. It utilizes EasyPACK packaging with press-fit pins and an integrated NTC for thermal monitoring. The module employs fourth-generation high-speed trench gate/field-stop IGBT technology paired with fourth-generation emitter-controlled diodes to ensure fast switching performance and reliable operation in power conversion applications.

Feature Summary

Integrates fourth-generation high-speed trench gate/field-stop IGBTs with fourth-generation emitter-controlled diodes
Features press-fit pin configuration for secure mechanical connection
Includes integrated NTC sensor for precise temperature monitoring

Applications

Three-level inverter systems
Industrial motor drives
High-efficiency power conversion units

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm exact technical specifications and package variants. Ensure compatibility with existing thermal management solutions due to the press-fit mounting requirement. Cross-reference datasheet revisions to confirm current manufacturing status and availability constraints before finalizing procurement plans.

Selection Notes

Select this component for applications requiring three-level topology with high reliability. The integrated NTC facilitates accurate thermal protection. Verify that the system design supports press-fit assembly methods. Confirm voltage and current ratings align with the specific load requirements of the target inverter or drive application.

Part Context

This part belongs to Infineon's EasyPACK family, designed for compact and efficient power integration. It combines advanced silicon technology with robust packaging to support modern power electronics designs. The module is engineered for industrial environments demanding high performance and long-term stability.

Replacement Considerations

Consult official Infineon substitution guides for verified alternatives. Generic cross-references are not recommended without explicit manufacturer confirmation.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.