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Product Detailed Parameters
- Description：EASY STANDARD
- Series：EasyPACK™ 2B
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Level Inverter
- Vce(on) (Max) @ Vge, Ic：1.81V @ 15V, 20A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：650 V
- Current - Collector (Ic) (Max)：20 A
- Power - Max：-
- Current - Collector Cutoff (Max)：18 µA
- Input Capacitance (Cies) @ Vce：1940 pF @ 25 V
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Overview
The FS3L40R07W2H5FB70BPSA1 is a three-phase inverter IGBT module from Infineon Technologies, utilizing the EasyPACK 2B package. It integrates TRENCHSTOP™ IGBT H5 technology with CoolSiC™ Schottky diodes and an NTC thermistor. The device features a maximum collector-emitter voltage of 650 V and a continuous collector current of 40 A at 25°C. Key electrical parameters include a saturation voltage of 1.18 V and a gate-emitter leakage current of 100 nA. It operates within a temperature range of -40°C to +150°C and supports Press Fit mounting.
Feature Summary
- Integrates TRENCHSTOP™ IGBT H5 technology for optimized switching performance
- Incorporates CoolSiC™ Schottky diodes to reduce reverse recovery losses
- Includes an integrated NTC thermistor for precise thermal monitoring
- Designed for robust operation in industrial power conversion applications
Applications
- Industrial motor drives and variable speed drives
- Uninterruptible power supply (UPS) systems
- Solar photovoltaic inverters
- Induction heating equipment
Procurement Notes
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm pinout compatibility and internal component configuration. Ensure that the required press-fit tooling matches the EasyPACK 2B package specifications. Confirm RoHS compliance status and lead times directly with authorized distributors or the manufacturer before finalizing procurement plans.
Selection Notes
Select this module when high efficiency and compact size are critical for 650V applications. The combination of silicon IGBTs and silicon carbide diodes offers superior performance compared to standard silicon diode modules. Consider the 40A current rating and thermal management requirements relative to the expected load profile and ambient operating conditions.
Part Context
This component belongs to Infineon's EasyPACK 2B family, designed for space-constrained industrial applications. It represents a generation of modules combining mature IGBT technology with wide-bandgap SiC diodes to enhance overall system efficiency and power density.
Replacement Considerations
Direct replacements must match the 650V/40A rating, EasyPACK 2B footprint, and Press Fit mounting style. Verify if alternative modules require changes to gate driver circuits due to differences in switching characteristics or saturation voltages between different IGBT generations.
