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Product Detailed Parameters
- Description：MEDIUM POWER ECONO AG-ECONOPP-2
- Series：EconoPACK™+
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：2.2V @ 15V, 450A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-ECONOPP-2-1
- Voltage - Collector Emitter Breakdown (Max)：1700 V
- Current - Collector (Ic) (Max)：450 A
- Power - Max：-
- Current - Collector Cutoff (Max)：3 mA
- Input Capacitance (Cies) @ Vce：37 nF @ 25 V
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Overview
The FS450R17OP4BPSA1 is a six-pack IGBT module from Infineon Technologies, utilizing Trench/Fieldstop IGBT4 technology and Emitter Controlled 3 diodes. It features PressFIT connection technology and an isolated base plate. Key electrical parameters include a collector-emitter voltage (VCES) of 1700 V and a continuous DC collector current (ICDC) of 450 A at TC = 90°C. The repetitive peak collector current (ICRM) is 900 A. The typical collector-emitter saturation voltage (VCEsat) is 1.70 V at Tvj = 25°C. Operating junction temperature ranges from -40°C to 150°C.
Feature Summary
- High short-circuit and surge current capability
- Integrated NTC temperature sensor for thermal monitoring
- PressFIT contact technology for robust mechanical mounting
- Isolated copper base plate with basic insulation
Applications
- Auxiliary inverters
- High power converters
- Motor drives
- Wind turbines
Procurement Notes
Verify the component against official datasheet specifications before integration. Confirm that the PressFIT termination method aligns with the target PCB or busbar design requirements. Ensure the isolation test voltage and creepage distances meet the safety standards of the final equipment. Cross-reference the serial number and date code on the module label for traceability purposes.
Selection Notes
Select this module for applications requiring high robustness and a 1700 V rating. The six-pack configuration supports three-phase bridge circuits. Consider the thermal resistance values when designing the heatsink interface. Verify that the gate drive circuitry can accommodate the specified gate threshold voltage and charge requirements for reliable switching performance.
Part Context
This component belongs to the EconoPACK+ series by Infineon Technologies. It integrates Trench/Fieldstop IGBT4 chips with Emitter Controlled 3 diodes. The module utilizes PressFIT technology instead of traditional soldering for terminal connections. It is designed for medium to high-power industrial applications requiring high reliability and mechanical stability.
Replacement Considerations
Consult official replacement lists for compatible modules within the same voltage and current class. Verify pinout compatibility and thermal characteristics before substitution. Ensure that any alternative part supports the required PressFIT mounting style or requires adapter modifications.
