FS75R17W2E4PB11BPSA1

Overview

The FS75R17W2E4PB11BPSA1 is a six-pack IGBT module from the EasyPACK 2B series, utilizing Trench/Fieldstop IGBT4 technology. It features a collector-emitter voltage (VCES) of 1700 V and a nominal collector current (ICN) of 75 A. The continuous DC collector current is rated at 45 A under specified thermal conditions. The module integrates emitter-controlled diodes with a forward current capability of 50 A. Key electrical parameters include a typical saturation voltage (VCE,sat) of 2.30 V at 25 °C and a maximum gate-emitter voltage of ±20 V. It incorporates an NTC thermistor with a rated resistance of 5 kΩ at 25 °C for thermal monitoring.

Feature Summary

• Utilizes PressFIT contact technology for robust mechanical mounting without soldering.
• Features pre-applied thermal interface material to simplify assembly and ensure consistent thermal performance.
• Includes integrated mounting clamps to provide rugged installation stability.
• Built on an Al2O3 substrate designed for low thermal resistance.

Applications

• UPS systems
• Air conditioning units
• Motor drives
• Servo drives

Procurement Notes

Verify component authenticity by cross-referencing the manufacturer's part number and datasheet revision against official Infineon documentation. Confirm that the specific ordering suffix matches the required technical specifications, as variations may exist within the product family. Ensure compliance with industrial qualification standards such as IEC 60747 and IEC 60068 relevant to the intended deployment environment.

Selection Notes

Select this module for applications requiring high voltage blocking capabilities up to 1700 V and moderate current handling around 75 A. Consider the thermal resistance values provided in the datasheet when designing the heatsink system. Verify that the switching losses and gate charge characteristics align with the driver circuit requirements and operating frequency constraints of the target power electronics design.

Part Context

This component belongs to the EasyPACK 2B series, which offers a compact design suitable for modern power conversion systems. The series is characterized by flexible pin grid systems and is optimized for industrial applications. It represents a generation of modules integrating advanced IGBT4 technology with practical mechanical features like press-fit contacts and integrated thermal management solutions.

Replacement Considerations

Consult official Infineon replacement guides or datasheets for confirmed substitute part numbers. Do not assume functional equivalence based solely on package dimensions or generic voltage ratings. Verify that any alternative component meets the same electrical and thermal specifications required for the specific application.