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The FS770R08A6P2BBPSA1 is a six-pack HybridPACK Drive module featuring EDT2 IGBTs and diodes. It has a collector-emitter voltage of 750 V and an implemented current of 770 A. The continuous DC collector current is 450 A at 75°C baseplate temperature. Saturation voltage is 1.10 V to 1.35 V depending on junction temperature. Switching losses include turn-on energy of 13.5 mJ to 18.0 mJ and turn-off energy of 23.5 mJ to 30.0 mJ at 450 A. Thermal resistance from junction to fluid is 0.130 K/W for the IGBT and 0.185 K/W for the diode. The module includes an integrated NTC thermistor with 5.00 kΩ resistance at 25°C.
Verify the specific ordering code against official Infineon documentation, as suffixes may indicate variations in packaging or testing criteria. Confirm that the required thermal interface materials and mounting torques align with the assembly application notes provided by the manufacturer. Ensure the cooling system design meets the specified pressure drop and flow rate requirements for optimal thermal performance.
Select this module for high-power density traction inverter designs requiring 750 V blocking capability. The EDT2 technology offers improved light load efficiency suitable for real driving cycles. Consider the flat baseplate configuration for direct cooled systems. Evaluate the short-time extended operation temperature capability if higher thermal stress is anticipated during peak loads.
This component belongs to the HybridPACK Drive family, which provides scalable power solutions for hybrid and electric vehicle traction. The FS770R08A6P2B variant utilizes a flat baseplate design, distinguishing it from PinFin baseplate derivatives within the same series. It represents a compact six-pack solution optimized for automotive environments.
FS820R08A6P2B is a derivative within the HybridPACK Drive family featuring a PinFin baseplate instead of a flat baseplate. Both modules share similar electrical characteristics but differ in mechanical cooling structures. Verify mechanical compatibility and thermal interface requirements when substituting between these variants.