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The FS800R07A2E3BOSA4 is a HybridPACK 2 IGBT module manufactured by Infineon Technologies. It utilizes Trench Fieldstop IGBT3 technology with an integrated NTC temperature sensor. The module features a six-pack configuration with a maximum collector-emitter voltage of 650 V and a continuous collector current of 800 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 1.4 V, a gate-emitter leakage current of 400 nA, and a power dissipation rating of 1.55 kW. It operates within a junction temperature range of -40°C to +150°C continuously, with a peak capability up to 175°C for short durations.
Verify the specific ordering suffix against official Infineon documentation to confirm pinout compatibility and internal component variations. Confirm availability status as distribution channels may list discontinued or limited stock items. Ensure the supplier provides valid traceability documents and original manufacturer certification before finalizing any acquisition.
Select this module for applications requiring high current density and efficient liquid cooling integration. Verify that the system design supports the HybridPACK 2 mechanical footprint and direct cooling requirements. Ensure the gate driver circuitry matches the specified electrical characteristics and thermal management strategy aligns with the module's heat dissipation capabilities.
This component belongs to the HybridPACK 2 family designed for automotive traction applications. It represents a high-power density solution utilizing advanced IGBT3 wafer technology. The series is engineered to meet stringent automotive reliability standards while providing superior thermal performance through its specialized cooling structure.
Publicly confirmed substitute part numbers are not available in the provided source material. Consult official Infineon replacement guides for compatible alternatives.