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FST160100 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is DIODE MOD SCHOTTKY 100V TO-249AB. Review the specifications below when checking this part for your BOM.
The FST160100 is a silicon power Schottky diode module manufactured by GeneSiC Semiconductor. It features a TO-249AB package with an isolated plate design and is not ESD sensitive. The device supports a repetitive peak reverse voltage of 100 V, with RMS and DC blocking voltages of 71 V and 100 V respectively. It provides an average forward current of 160 A per package and a peak forward surge current of 1000 A per leg. The junction-to-case thermal resistance is 0.50 °C/W per leg, and the maximum instantaneous forward voltage is 0.84 V at Tj = 150 °C.
Verify the specific part number suffix against official datasheets to confirm voltage ratings and package variations. Ensure thermal management solutions align with the specified junction-to-case thermal resistance. Confirm operating temperature ranges meet system requirements before integration.
Select this component for applications requiring high current density and low forward voltage drop. Consider the TO-249AB package dimensions for mechanical fit. Evaluate thermal performance based on the 0.50 °C/W junction-to-case resistance under expected load conditions.
This module belongs to the FST160 series, which includes variants from 45 V to 100 V VRRM. All models share the same 160 A average forward current rating and TO-249AB package form factor, differing primarily in reverse voltage specifications.
Cross-reference with other 160 A Schottky modules in TO-249AB packages. Verify compatibility of pinout and thermal characteristics when substituting with equivalent parts from other manufacturers.
The maximum operating junction temperature is 150 °C.
No, the FST160100 is not ESD sensitive.
The peak forward surge current is 1000 A per leg for an 8.3 ms half-sine wave pulse.
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