FET, MOSFET Arrays G33N03D3 product image

G33N03D3

$0.13
  • Description:MOSFET 2N-CH 30V 30A 8DFN
  • Series:TrenchFET®

SKU:2cfac0eab7d5 Category: Brand:

  
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G33N03D3 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Goford Semiconductor. Its product description is MOSFET 2N-CH 30V 30A 8DFN. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for G33N03D3

  • Description:MOSFET 2N-CH 30V 30A 8DFN
  • Series:TrenchFET®
  • Mfr:Goford Semiconductor
  • Package:Tape & Reel (TR)
  • Technology:MOSFET (Metal Oxide)
  • Configuration:-
  • FET Feature:-
  • Drain to Source Voltage (Vdss):30V
  • Current - Continuous Drain (Id) @ 25°C:28A (Tc)
  • Rds On (Max) @ Id, Vgs:11mOhm @ 16A, 10V
  • Vgs(th) (Max) @ Id:2.5V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:16nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds:837pF @ 15V
  • Power - Max:13W (Tc)
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-PowerVDFN
  • Supplier Device Package:8-DFN (3x3)
  • Grade:-
  • Qualification:-

FET, MOSFET Arrays datasheet and documents for G33N03D3

G33N03D3

FET, MOSFET Arrays Overview

The G33N03D3 is a dual N-channel enhancement mode power MOSFET manufactured by Goford Semiconductor. It utilizes advanced trench technology to deliver low on-resistance and gate charge. The device features a drain-source voltage of 30V and a continuous drain current of 28A at 25°C case temperature. On-resistance is specified as less than 11mΩ at VGS=10V and less than 14mΩ at VGS=4.5V. It is housed in an 8-lead DFN3x3 package with a maximum junction-to-case thermal resistance of 9.5°C/W.

FET, MOSFET Arrays Feature Summary

  • Dual N-channel configuration providing identical high-side and low-side switch characteristics for bridge applications.
  • Advanced trench technology designed to minimize on-resistance and reduce gate charge requirements.
  • 100% avalanche tested to ensure robustness against high-voltage transient events.

FET, MOSFET Arrays Applications

  • Power switching circuits
  • DC/DC converter topologies

FET, MOSFET Arrays Procurement Notes

Verify the specific ordering suffix against official distributor catalogs to confirm packaging format, such as tape and reel quantities or cut tape availability. Confirm RoHS compliance status directly from the manufacturer's latest documentation before finalizing procurement specifications.

FET, MOSFET Arrays Selection Notes

Select this component for designs requiring a compact dual-N channel solution within a 30V system. Ensure the gate drive voltage meets the threshold requirements for the desired on-resistance level. Verify that the PCB copper area supports the required thermal dissipation given the 9.5°C/W junction-to-case rating.

FET, MOSFET Arrays Part Context

This part belongs to the Goford Semiconductor discrete semiconductor lineup, specifically categorized under dual-channel MOSFETs. It is designed for surface-mount assembly using the DFN3x3-8L package, targeting space-constrained power management applications.

FET, MOSFET Arrays Replacement Considerations

No public substitute part numbers are documented for this component.

FET, MOSFET Arrays FAQ

What is the maximum pulsed drain current?

The maximum pulsed drain current (IDM) is 112 A.

Is the device qualified for avalanche energy conditions?

Yes, the datasheet confirms the device is 100% avalanche tested with a single pulse avalanche energy (EAS) rating of 42 mJ.

What is the reverse recovery time of the body diode?

The reverse recovery time (Trr) is 17 ns when measured at IF = 16A and di/dt = 100A/us.

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