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The GTVA261701FA-V1-R2 is a Gallium Nitride (GaN) High Electron Mobility Transistor (HEMT) manufactured by MACOM Technology Solutions. It is designed for high-power radio frequency applications within the 2.62 GHz to 2.69 GHz frequency range. The device delivers an output power of 170 W with a gain of 17 dB. Key electrical specifications include a drain-source breakdown voltage of 150 V and a continuous drain current of 7.5 A. The component operates at a maximum junction temperature of +225°C and utilizes an H-37265J-2 surface-mount package.
Verify the specific suffix against official MACOM documentation, as variations such as -R0 or -R2 may indicate different reel packaging or minor manufacturing revisions without altering core electrical performance. Confirm RoHS compliance status through the latest datasheet. Ensure the ordering quantity aligns with manufacturer minimum order requirements for tape-and-reel delivery formats.
Select this component when designing amplifiers requiring 170 W output power in the 2.6–2.7 GHz band. Consider the 150 V breakdown voltage for biasing network design. Evaluate the H-37265J-2 package dimensions for PCB layout compatibility. Compare thermal resistance parameters against system heat sinking capabilities to ensure reliable operation at +225°C maximum junction temperature.
This part belongs to MACOM's portfolio of GaN RF power transistors. These devices are engineered to replace traditional LDMOS technologies in high-frequency, high-power applications. The product line emphasizes reliability and linearity for demanding wireless infrastructure environments.
Consult MACOM official substitution guides for direct equivalents. Cross-reference pinouts and thermal pads with alternative GaN HEMTs from other manufacturers if sourcing constraints exist. Verify that any substitute matches the 170 W power class and S-band frequency coverage.