GWM100-01X1-SMD

FET, MOSFET Arrays Overview

The GWM100-01X1-SMD is a three-phase full bridge MOSFET module manufactured by IXYS. It utilizes trench technology MOSFETs to achieve low on-resistance. The device is housed in an ISOPLUS-DIL-17 surface mount package, designed for high current applications. Key electrical specifications include a voltage rating of 100V and a continuous current capacity of 90A to 100A. The module integrates six switches into a single isolated DCB package, facilitating efficient thermal management and compact PCB integration for power conversion systems.

FET, MOSFET Arrays Feature Summary

• Three-phase full bridge configuration integrating six trench MOSFETs
• ISOPLUS-DIL-17 surface mount package with DCB isolation
• Low on-state resistance due to advanced trench technology

FET, MOSFET Arrays Applications

• Motor drives and control systems
• DC-AC power inversion circuits
• Industrial power supply modules

FET, MOSFET Arrays Procurement Notes

Verify the specific suffix or variant against the official IXYS datasheet to ensure compatibility with your design requirements. Confirm that the ISOPLUS-DIL-17 footprint matches your PCB layout constraints. Check for any specific handling instructions regarding electrostatic discharge protection during assembly. Ensure thermal interface materials are compatible with the module's base plate for optimal heat dissipation performance.

FET, MOSFET Arrays Selection Notes

Select this component when a compact, surface-mount solution for three-phase power switching is required. The 100V rating suits low-voltage DC bus applications. Consider the 90A-100A current capability for moderate power density designs. The integrated bridge structure reduces component count and interconnection parasitics compared to discrete implementations. Evaluate thermal resistance parameters for your specific heatsinking strategy.

FET, MOSFET Arrays Part Context

This part belongs to IXYS' family of high-power MOSFET modules. It represents a consolidated solution for three-phase applications, replacing multiple discrete components. The ISOPLUS-DIL series is designed for robust mechanical mounting and efficient thermal transfer. This specific model targets applications requiring high reliability and simplified assembly processes in power electronics.

FET, MOSFET Arrays Replacement Considerations

Consult IXYS documentation for direct pin-compatible alternatives within the ISOPLUS-DIL series. Verify that substitute parts match the 100V voltage rating and similar current handling capabilities. Ensure the replacement maintains the same surface mount footprint and thermal characteristics to avoid redesigning the PCB or cooling system.