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The HGTG24N60D1 is a single N-channel Insulated Gate Bipolar Transistor (IGBT) manufactured by Harris Corporation, now part of onsemi. It features a collector-emitter breakdown voltage (VCEO) of 600 V and a continuous collector current (Ic) of 24 A at 25°C. The device utilizes Ultrafast Soft (UFS) switching technology to minimize reverse recovery charge and tail current. It is housed in a TO-247 package with a maximum power dissipation of 104 W. The component operates within a temperature range of -40°C to +150°C.
Verify the manufacturer status as Harris Corporation assets were acquired by Fairchild Semiconductor, which was subsequently acquired by onsemi. Confirm that the specific lot date code aligns with legacy production schedules. Ensure the datasheet version matches the manufacturing era to validate electrical characteristics against current standards.
Select this component when a 600V rating and 24A current capacity are required in a through-hole TO-247 package. The UFS characteristic makes it suitable for applications demanding lower switching losses and reduced noise compared to standard IGBTs. Verify thermal management requirements given the 104W power dissipation limit.
This part belongs to the HGTG series of rugged, high-voltage IGBTs originally developed by Harris Semiconductor. The series is characterized by its use of UFS technology, providing a balance between low conduction loss and fast switching performance. It serves as a discrete solution for medium-power conversion tasks.
Direct replacements include the HGTP12N60C3D or HGTG12N60C3D from onsemi/Fairchild, noting potential differences in packaging or exact current ratings. Cross-reference with other 600V, 24A UFS IGBTs from manufacturers like Infineon or Mitsubishi if pinout compatibility is critical.