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HSMP-481B-TR2G is listed in the RF Diode range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is RF DIODE PIN 100V SOT-323. Review the specifications below when checking this part for your BOM.
The HSMP-481B-TR2G is a surface mount PIN diode manufactured by Broadcom Limited, designed for low distortion attenuating and microwave frequency operation. It features ultra-low parasitic inductance within the SOT-323 package. The device has a minimum breakdown voltage of 100 V and a maximum total capacitance of 0.4 pF at 50 V reverse bias. Series resistance is specified as 3 Ohms at 100 mA forward current and 100 MHz. Typical total inductance is 1 nH. The component operates within a temperature range of -65°C to +150°C and supports a maximum forward current of 1 A.
Verify the specific ordering suffix against official documentation to confirm packaging configuration. The TR2G suffix indicates tape and reel packaging containing 10,000 devices per 13-inch reel. Ensure compliance with RoHS standards and lead-free requirements during procurement. Confirm availability status directly with authorized distributors or the manufacturer before initiating orders.
Select this component when designing circuits requiring minimal parasitic inductance for high-frequency performance up to 3 GHz. The dual cathode configuration allows for series connection of both leads to further reduce inductance in microstrip layouts. Verify that the 100 V breakdown voltage meets the peak inverse voltage requirements of the target application environment.
This part belongs to the HSMP-481x series of surface mount RF PIN diodes. The series includes variants such as HSMP-4810 and HSMP-481B, distinguished by their internal lead configurations. The HSMP-481B specifically utilizes a dual cathode arrangement, enabling flexible circuit topologies for attenuators and switches in compact surface mount designs.
Direct substitutes include other parts from the HSMP-481x family, such as HSMP-4810-BLK or HSMP-481B-BLK, provided the package and electrical characteristics align with the design requirements.
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