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Product Detailed Parameters
- Description：IGBT TRENCH FIELD STOP 1200V DIE
- Series：TrenchStop™
- Mfr：Infineon Technologies
- Package：Bulk
- IGBT Type：Trench Field Stop
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：-
- Current - Collector Pulsed (Icm)：75 A
- Vce(on) (Max) @ Vge, Ic：2.42V @ 15V, 25A
- Power - Max：-
- Switching Energy：-
- Input Type：Standard
- Gate Charge：-
- Td (on/off) @ 25°C：-
- Test Condition：-
- Reverse Recovery Time (trr)：-
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Surface Mount
- Package / Case：Die
- Supplier Device Package：Die
- Grade：-
- Qualification：-
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Overview
The IGC27T120T8QX1SA1 is a discrete silicon IGBT die manufactured by Infineon Technologies. It belongs to the HighSpeed 3 family, utilizing trench field-stop technology for optimized switching and conduction performance. The component features a maximum collector-emitter voltage of 1200 V and a continuous collector current rating of 27 A at 25°C. It operates within a junction temperature range of -40°C to +175°C and is designed for surface-mount integration into power modules.
Feature Summary
- High-speed switching characteristics with MOSFET-like turn-off behavior
- Optimized balance between low conduction and low switching losses
- Robust thermal design supporting high junction temperatures up to 175°C
Applications
- Industrial motor drives
- Switch-mode power supplies (SMPS)
- Uninterruptible power supplies (UPS)
Procurement Notes
Verify the specific datasheet revision and electrical parameter tolerances against the official Infineon documentation before finalizing designs. Confirm that the intended application environment aligns with the specified operating temperature range and packaging requirements for reliable long-term operation.
Selection Notes
Select this component when designing systems requiring a 1200 V rated IGBT with moderate current handling capabilities around 27 A. It is suitable for applications prioritizing efficiency in the 25 kHz to 70 kHz frequency range where low switching losses are critical.
Part Context
This part is a bare die from the HighSpeed 3 series, intended for integration into larger power modules rather than direct PCB mounting. It complements other discrete components in Infineon's portfolio for automotive and industrial power conversion solutions.
Replacement Considerations
Consult official Infineon substitution guides for compatible alternatives. Verify pinout compatibility and thermal resistance specifications if replacing existing dies in module assemblies.
