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IPG20N06S4L26AATMA1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET 2N-CH 60V 20A 8TDSON. Review the specifications below when checking this part for your BOM.
The IPG20N06S4L26AATMA1 is a dual N-channel OptiMOS-T2 power transistor in a PG-TDSON-8 package. It features a drain-source voltage of 60 V and a continuous drain current of 20 A per channel at 25°C. The maximum on-state resistance is 26 mΩ at VGS=10V. Total gate charge is 20 nC, with a thermal resistance junction-to-case of 4.5 K/W. It supports an operating temperature range from -55°C to +175°C and is qualified under AEC-Q101 standards.
Verify the specific ordering suffix matches the required tape-and-reel packaging format. Confirm that the component meets the necessary RoHS compliance requirements for your assembly process. Ensure the PG-TDSON-8 footprint aligns with your PCB design guidelines before finalizing procurement orders.
Select this component when a dual-channel solution is required for 60V applications. The low on-resistance minimizes conduction losses in high-current paths. Consider the thermal resistance specifications for heat dissipation requirements in enclosed automotive environments.
This device belongs to Infineon's OptiMOS-T2 family, designed for efficient power switching. It utilizes advanced trench technology to achieve low on-resistance and fast switching speeds. The dual configuration allows for space-saving designs in complex power systems.
Check datasheets for alternative dual N-channel MOSFETs with similar 60V ratings and comparable RDS(on) values. Verify pin compatibility and thermal characteristics to ensure seamless integration without redesigning the PCB layout.
The device can handle a pulsed drain current of 80 A per channel.
Yes, it is AEC-Q101 qualified and supports an operating temperature range up to 175°C.
The gate threshold voltage typically decreases as the junction temperature increases, ranging from 1.2 V to 2.2 V at 25°C.
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