IRF7103TRPBFXTMA1

FET, MOSFET Arrays Overview

The IRF7103TRPBFXTMA1 is a dual N-channel HEXFET power MOSFET manufactured by Infineon Technologies. It features a 50V drain-source breakdown voltage and supports a continuous drain current of 3A at 25°C. The device exhibits a maximum on-resistance of 130mΩ at 10V gate drive. It operates within a temperature range of -55°C to +150°C junction temperature, with a power dissipation rating of 2W. The component utilizes an SO-8 surface-mount package and incorporates planar FET technology for enhanced thermal performance.

FET, MOSFET Arrays Feature Summary

• Dual N-channel configuration integrated into a single SO-8 package for space-efficient circuit design.
• Planar FET technology providing ultra-low on-resistance and optimized switching characteristics.
• Customized leadframe structure designed to enhance thermal dissipation capabilities.

FET, MOSFET Arrays Applications

• Power supply circuits requiring compact dual-switch solutions
• DC-DC converter topologies utilizing low-voltage MOSFETs
• Battery management systems in portable electronic devices

FET, MOSFET Arrays Procurement Notes

Verify the complete part number including the XTMA1 suffix against official Infineon documentation to ensure correct reel packaging specifications. Confirm RoHS compliance status through the manufacturer's certified datasheet before integration. Validate that the SO-8 package dimensions match the target PCB footprint requirements precisely.

FET, MOSFET Arrays Selection Notes

Select this component when a dual N-channel topology is required in a small form factor. The 50V rating suits low-voltage applications where higher voltage ratings are unnecessary. Ensure the 3A current capacity meets the load requirements while accounting for thermal derating at elevated ambient temperatures.

FET, MOSFET Arrays Part Context

This device belongs to the HEXFET family of power MOSFETs from Infineon Technologies. It represents an evolution of standard discrete transistors by integrating two channels into one package. The SO-8 variant offers improved thermal handling compared to traditional DIP packages, supporting modern surface-mount assembly processes.

FET, MOSFET Arrays Replacement Considerations

IRF7103TRPBF serves as a direct equivalent alternative within the same product family. Verify pin compatibility and thermal resistance values when substituting components to maintain circuit performance integrity.