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IRF7314PBF is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET 2P-CH 20V 5.3A 8SO. Review the specifications below when checking this part for your BOM.
The IRF7314PBF is a dual N-channel HEXFET power MOSFET manufactured by Infineon Technologies, housed in an SO-8 surface-mount package. It features a drain-source voltage rating of 30V and a continuous drain current capability of 6.5A at 25°C. The device exhibits a maximum on-resistance of 46mΩ at a gate-source voltage of 4.5V and 29mΩ at 10V. Key electrical parameters include a typical total gate charge of 22nC at 10V and a thermal resistance from junction to ambient of 62.5 K/W. The component supports a maximum junction temperature of 150°C and operates within a temperature range of -55°C to 150°C.
Verify the specific ordering part number against official Infineon documentation to ensure correct suffix designation. Confirm that the requested variant matches the required package type and lead-free specifications. Cross-reference technical parameters such as RDS(on) limits and thermal ratings with the latest datasheet to ensure compliance with design requirements before finalizing procurement.
Select this component for applications requiring dual N-channel switching in a small form factor. Evaluate the 30V breakdown voltage and 6.5A current capacity against system load requirements. Consider the logic-level gate drive characteristics for compatibility with microcontroller or logic-level control signals. Assess thermal performance based on the specified junction-to-ambient resistance and expected operating environment.
The IRF7314PBF belongs to the HEXFET family of power MOSFETs from Infineon Technologies. This series utilizes advanced processing techniques to achieve low on-resistance relative to silicon area. The component is designed for efficient and reliable operation in battery and load management applications, offering a robust solution for power switching tasks in compact electronic designs.
Consult official cross-reference tools or manufacturer databases for verified substitute part numbers. Ensure any replacement maintains equivalent voltage, current, and thermal ratings. Verify package compatibility and pinout alignment to prevent board redesign. Confirm that alternative components meet the same logic-level drive requirements and safety certifications.
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